High Precision, Rail-to-Rail Output Operational Amplifier
| LMV2011_08 | LMV2011MAX | LMV2011MF | |
|---|---|---|---|
| Description | High Precision, Rail-to-Rail Output Operational Amplifier | High Precision, Rail-to-Rail Output Operational Amplifier | High Precision, Rail-to-Rail Output Operational Amplifier |
| Is it Rohs certified? | - | incompatible | incompatible |
| Maker | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Parts packaging code | - | SOIC | SOT-23 |
| package instruction | - | SOIC-8 | SOT-23, 5-PIN |
| Contacts | - | 8 | 5 |
| Reach Compliance Code | - | _compli | _compli |
| ECCN code | - | EAR99 | EAR99 |
| Amplifier type | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Nominal Common Mode Rejection Ratio | - | 100 dB | 130 dB |
| frequency compensation | - | YES | YES |
| Maximum input offset voltage | - | 25 µV | 35 µV |
| JESD-30 code | - | R-PDSO-G8 | R-PDSO-G5 |
| JESD-609 code | - | e0 | e0 |
| length | - | 4.902 mm | 2.92 mm |
| low-bias | - | YES | YES |
| low-dissonance | - | YES | YES |
| Humidity sensitivity level | - | 1 | 1 |
| Number of functions | - | 1 | 1 |
| Number of terminals | - | 8 | 5 |
| Maximum operating temperature | - | 70 °C | 70 °C |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | SOP | LSSOP |
| Encapsulate equivalent code | - | SOP8,.25 | TSOP5/6,.11,37 |
| Package shape | - | RECTANGULAR | RECTANGULAR |
| Package form | - | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| method of packing | - | TAPE AND REEL | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | - | 235 | 260 |
| power supply | - | 2.7/5 V | 2.7/5 V |
| Certification status | - | Not Qualified | Not Qualified |
| Maximum seat height | - | 1.753 mm | 1.22 mm |
| Nominal slew rate | - | 4 V/us | 4 V/us |
| Maximum slew rate | - | 1.5 mA | 1.5 mA |
| Supply voltage upper limit | - | 5.5 V | 5.5 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V |
| surface mount | - | YES | YES |
| technology | - | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | GULL WING | GULL WING |
| Terminal pitch | - | 1.27 mm | 0.95 mm |
| Terminal location | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | 30 | 40 |
| Nominal Uniform Gain Bandwidth | - | 3000 kHz | 3000 kHz |
| width | - | 3.899 mm | 1.6 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD