MASK ROM, 4MX8, 200ns, CMOS, PDSO48, PLASTIC, TSOP-48
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Macronix |
Parts packaging code | TSOP |
package instruction | TSOP1, |
Contacts | 48 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 200 ns |
Spare memory width | 16 |
JESD-30 code | R-PDSO-G48 |
JESD-609 code | e0 |
length | 18.4 mm |
memory density | 33554432 bi |
Memory IC Type | MASK ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP1 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 12 mm |
MX23C3210TC-20 | MX23C3210MC-20 | MX23C3210PC-20 | MX23C3210RC-20 | |
---|---|---|---|---|
Description | MASK ROM, 4MX8, 200ns, CMOS, PDSO48, PLASTIC, TSOP-48 | MASK ROM, 4MX8, 200ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44 | MASK ROM, 2MX16, 200ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | MASK ROM, 4MX8, 200ns, CMOS, PDSO48, PLASTIC, REVERSE, TSOP-48 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Macronix | Macronix | Macronix | Macronix |
Parts packaging code | TSOP | SOIC | DIP | TSOP |
package instruction | TSOP1, | SOP, SOP44,.63 | DIP, DIP42,.6 | TSOP1-R, |
Contacts | 48 | 44 | 42 | 48 |
Reach Compliance Code | unknow | unknown | unknown | unknow |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 200 ns | 200 ns | 200 ns | 200 ns |
Spare memory width | 16 | 16 | 8 | 16 |
JESD-30 code | R-PDSO-G48 | R-PDSO-G44 | R-PDIP-T42 | R-PDSO-G48 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 18.4 mm | 28.49 mm | 52.07 mm | 18.4 mm |
memory density | 33554432 bi | 33554432 bit | 33554432 bit | 33554432 bi |
Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
memory width | 8 | 8 | 16 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 48 | 44 | 42 | 48 |
word count | 4194304 words | 4194304 words | 2097152 words | 4194304 words |
character code | 4000000 | 4000000 | 2000000 | 4000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4MX8 | 4MX8 | 2MX16 | 4MX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSOP1 | SOP | DIP | TSOP1-R |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 3 mm | 5.33 mm | 1.2 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
Terminal form | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
Terminal pitch | 0.5 mm | 1.27 mm | 2.54 mm | 0.5 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 12 mm | 12.6 mm | 15.24 mm | 12 mm |