CPZ19-BZX84C6V8 THRU
CPZ19-BZX84C47
w w w. c e n t r a l s e m i .
c o m
Zener Diode Die
350mW, 6.8 THRU 47 VOLT
The CPZ19-BZX84C6V8 thru CPZ19-BZX84C47 are silicon Zener diodes ideal for all types of
commercial, industrial, entertainment, and computer applications.
MECHANICAL SPECIFICATIONS:
Die Size
Die Thickness
Anode Bonding Pad Size
Top Side Metalization
Back Side Metalization
Scribe Alley Width
Wafer Diameter
BACKSIDE CATHODE
R0
17.7 x 17.7 MILS
7.5 MILS
11 x 11 MILS
Al – 13,000Å
Au – 14,000Å
1.6 MILS
4 INCHES
36,642
UNITS
°C
Gross Die Per Wafer
SYMBOL
TJ, Tstg
MAXIMUM RATINGS:
Operating and Storage Junction Temperature
-65 to +150
ELECTRICAL CHARACTERISTICS:
(TA=25°C) VF=0.9V MAX @ IF=10mA (for all types)
Zener
Voltage
Type
MIN
V
CPZ19-BZX84C6V8
CPZ19-BZX84C7V5
CPZ19-BZX84C8V2
CPZ19-BZX84C9V1
CPZ19-BZX84C10
CPZ19-BZX84C11
CPZ19-BZX84C12
CPZ19-BZX84C13
CPZ19-BZX84C15
CPZ19-BZX84C16
CPZ19-BZX84C18
CPZ19-BZX84C20
CPZ19-BZX84C22
CPZ19-BZX84C24
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
VZ @ IZT
NOM
V
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
MAX
V
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
IZT
mA
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
Test
Current
Maximum
Zener
Impedance
ZZT @ IZT ZZK @ IZK
Ω
15
15
15
15
20
20
25
30
30
40
45
55
55
70
Ω
80
80
80
100
150
150
150
170
200
200
225
225
250
250
mA
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Maximum
Reverse
Current
IR @ VR
μA
2.0
1.0
0.7
0.5
0.2
0.1
0.1
0.1
0.05
0.05
0.05
0.05
0.05
0.05
V
4.0
5.0
5.0
6.0
7.0
8.0
8.0
8.0
10.5
11.2
12.6
14.0
15.4
16.8
Maximum Maximum
Zener
Temperature
Current
Coefficient
IZM
mA
37
33
30
27
25
23
21
19
17
16
14
12
11
10
ΘV
Z
% / °C
0.05
0.05
0.06
0.06
0.07
0.07
0.07
0.08
0.08
0.08
0.08
0.08
0.09
0.09
R0 (21-November 2016)
CPZ19-BZX84C6V8 THRU
CPZ19-BZX84C47
Zener Diode Die
350mW, 6.8 THRU 47 VOLT
w w w. c e n t r a l s e m i .
c o m
ELECTRICAL CHARACTERISTICS - Continued:
(TA=25°C) VF=0.9V MAX @ IF=10mA (for all types)
Zener
Voltage
Type
MIN
V
CPZ19-BZX84C27
CPZ19-BZX84C30
CPZ19-BZX84C33
CPZ19-BZX84C36
CPZ19-BZX84C39
CPZ19-BZX84C43
CPZ19-BZX84C47
25.1
28.0
31.0
34.0
37.0
40.0
44.0
VZ @ IZT
NOM
V
27
30
33
36
39
43
47
MAX
V
28.9
32.0
35.0
38.0
41.0
46.0
50.0
IZT
mA
2.0
2.0
2.0
2.0
2.0
2.0
2.0
Test
Current
Maximum
Zener
Impedance
ZZT @ IZT ZZK @ IZK
Ω
80
80
80
90
130
150
170
Ω
300
300
325
350
350
375
375
mA
0.5
0.5
0.5
0.5
0.5
0.5
0.5
Maximum
Reverse
Current
IR @ VR
μA
0.05
0.05
0.05
0.05
0.05
0.05
0.05
V
18.9
21.0
23.1
25.2
27.3
30.1
32.9
Maximum Maximum
Zener
Temperature
Current
Coefficient
IZM
mA
9.0
8.0
7.0
6.9
6.4
5.8
5.3
ΘV
Z
% / °C
0.09
0.09
0.09
0.09
0.09
0.10
0.10
R0 (21-November 2016)
CPZ19-BZX84C6V8 THRU
CPZ19-BZX84C47
Typical Electrical Characteristics
w w w. c e n t r a l s e m i .
c o m
R0 (21-November 2016)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT:
Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM:
Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN:
Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR:
Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
SAWN WAFER ON METAL FRAME
WS:
Full wafer, sawn and mounted on metal frame,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WS)
R0 (7-December 2015)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
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• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2
nd
day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
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which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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