EEPROM, 32KX8, 300ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Catalyst |
| Parts packaging code | QFJ |
| package instruction | QCCJ, LDCC32,.5X.6 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 300 ns |
| command user interface | NO |
| Data polling | YES |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 262144 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| page size | 64 words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3 V |
| Programming voltage | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.55 mm |
| Maximum standby current | 0.00015 A |
| Maximum slew rate | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| switch bit | YES |
| width | 11.43 mm |
| Maximum write cycle time (tWC) | 10 ms |
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