QFM
www.vishay.com
Vishay Electro-Films
Thin Film, Top-Contact Resistor
FEATURES
• Wire bondable
• Small size: 0.020 inches square
• Case: 0202
• Resistance range: 1.0
to 1 M
• DC power rating: 25 mW
Product may not be to scale
• Quartz substrate: < 0.1 pF shunt capacitance
• Resistor material: tantalum nitride, self passivating
• Moisture resistant
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
The QFM series tantalum nitride on quartz single-value
resistor chips offer a small size, wide ohmic value range and
excellent frequency response.
The QFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
The QFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The QFMs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
APPLICATIONS
The QFM top-contact resistor chips are designed to handle
substantial power loads in many types of hybrid packages.
They are ideally suited for this purpose because of their
small size.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
Standard Tolerances
TCR
VALUE
1 to 1M
± 0.1, ± 1, ± 5
± 25, ± 50, ± 100, ± 250
UNIT
%
ppm/°C
Tightest Standard Tolerance Available
1 % 0.5 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
1
Ω
10
Ω
30
Ω
100
Ω
200 kΩ 430 kΩ 620 kΩ 1 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
to 250 k
< 100
or > 251 k
Moisture Resistance, MIL-STD-202, Method 106
Stability, 1000 h, +125 °C, 12.5 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, +150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at +70 °C (Derated to zero at +175 °C)
5x Rated Power Short-Time Overload, +25 °C, 5 s
Revision: 30-Mar-17
VALUE
-35 typ.
-20 typ.
± 0.5
R/R
± (0.25 + 0.01
) R/R
-55 to +125
± 0.25 max.
R/R
± 0.5 max.
R/R
200
10
12
min.
100 max.
0.025
± 0.25 max.
R/R
UNIT
dB
%
%
°C
%
%
V
V
W
%
Document Number: 61078
1
For technical questions, contact:
efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
QFM
www.vishay.com
CONFIGURATIONS
in inches
0.004
0.020
0.020
Vishay Electro-Films
0.007
0.020
0.016
0.006
0.004
0.016
TYPICAL RANGE
1
Ω
to 29
Ω
0.004
TYPICAL RANGE
30
Ω
to 819
Ω
0.004
TYPICAL RANGE
820
Ω
to 1 MΩ
SCHEMATIC
MECHANICAL SPECIFICATIONS
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad size
Number of Pads
Pad Material
Backing
VALUE
0.020" x 0.020" ± 0.003" (0.5 mm x 0.5 mm ± 0.076 mm)
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Quartz
Tantalum nitride, self-passivating
0.004" x 0.004" (0.10 mm x 0.10 mm) minimum
2
10 kÅ minimum aluminum (Au optional)
None, lapped quartz (Au optional)
GLOBAL PART NUMBER INFORMATION
Global Part Number: QFM50000FKANHWS
Global Part Number Description: QFM 5K 1 % 100 ppm/°C Al None H WS
Q
F
M
5
0
0
TOLERANCE
CODE
(%)
B
= 0.1
C
= 0.25
D
= 0.5
F
= 1.0
G
= 2.0
J
= 5.0
K
= 10.0
0
0
F
K
A
N
H
W
S
MODEL
QFM
RESISTANCE
First 4 digits
are significant
figures of
resistance
RESISTANCE
MULTIPLIER
CODE
C
= 0.001
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
TCR
(ppm/°C)
E
= ± 25
C
= ± 50
K
= ± 100
M
= ± 250
TERMINATION
G
= gold
A
= aluminum
BACK
METAL
G
= gold
N
= none
VISUAL
CLASS
H
= class H
K
= class K
PACKAGING
CODE
WS
=
waffle pack
100 min., 1 mult
Revision: 30-Mar-17
Document Number: 61078
2
For technical questions, contact:
efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Revision: 08-Feb-17
1
Document Number: 91000