GT23SC55160 datasheet, PDF - EEWORLD Datasheet

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GT23SC55160: DescriptionGT23SC55160 Multi I/O Secure Flash Card; Categorystorage; File Size70KB，5 Pages; ManufacturerGiantec; Websitehttp://www.giantec-semi.com/cn; Giantec Semiconductor Inc. is a high-tech company located in Zhangjiang Hi-Tech Park, specializing in R&D, manufacturing and sales of high-performance, high-quality analog and digital integrated circuit products. Its purpose is not only to provide customers with the components they need, but also to provide customers with complete application solutions. Giantec Semiconductor Inc. was formerly the wholly-owned subsidiary of ISSI (Integrated Silicon Solution, Inc.) in the United States, Core Semiconductor (Shanghai) Co., Ltd. Giantec's core team includes managers who have accumulated 10 to 20 years of senior management experience in domestic and foreign integrated circuit design companies, as well as technical experts with more than 10 years of experience in digital and analog product design.

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GT23SC55160 Overview

GT23SC55160 Multi I/O Secure Flash Card

Features

• GT23SC55160 is a high security, high performance enhanced 8051 smart card chip which is targeting at contact smart card applications such as SIM/PIM/UIM, EMV, PBOC and others.

• GT23SC55160 offers 256 bytes internal RAM, 2048 bytes XRAM and 160 Kbytes FLASH (including 2K bytes for boot loader), which can be used as both data and program memory. The non-volatile memory consists of high reliability cells to guarantee data integrity. To minimize the overall power consumption, GT23SC4464 also offers two kinds of sleeping mode for low power applications.

• GT23SC55160 conforms to ISO7816 standards and GSM11.11/GSM11.12 standards. In conclusion, GT23SC55160 integrates outstanding and configurable memory sizes, additional co-processors for CRC generation and DES/TDES operation, enough measurement in term of security, sufficient peripherals in combination with enhanced performance and optimized power consumption on a most competitive die size to match the requirement of today’s IC card application.

Parameters

• Capacity: 160K

• Architecture: 160K Byte Flash

• Power supply voltage: 2.7V-5.5V

• Operating frequency (MHz): 30

• Packaging: wafer, module

• Production status:

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GT23SC55160 Datasheet

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