RK80532PC056512/SL6E9 datasheet, PDF

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RK80532PC056512/SL6E9: DescriptionRISC Microprocessor, 32-Bit, 2400MHz, CMOS, CPGA478; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，85 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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RK80532PC056512/SL6E9 Overview

RISC Microprocessor, 32-Bit, 2400MHz, CMOS, CPGA478

RK80532PC056512/SL6E9 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Intel
package instruction	SPGA, PGA478,26X26,50
Reach Compliance Code	unknow
bit size	32
JESD-30 code	S-XPGA-P478
Number of terminals	478
Package body material	CERAMIC
encapsulated code	SPGA
Encapsulate equivalent code	PGA478,26X26,50
Package shape	SQUARE
Package form	GRID ARRAY, SHRINK PITCH
power supply	1.5 V
Certification status	Not Qualified
speed	2400 MHz
Nominal supply voltage	1.5 V
surface mount	NO
technology	CMOS
Terminal form	PIN/PEG
Terminal pitch	1.27 mm
Terminal location	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Intel

Pentium

4 Processor with 512-KB

L2 Cache on 0.13 Micron Process and

Intel

Pentium

4 Processor Extreme

Edition Supporting Hyper-Threading

Technology

Datasheet

2 GHz – 3.40 GHz Frequencies Supporting Hyper-Threading

Technology

at 3.06 GHz with 533 MHz System Bus and All

Frequencies with 800 MHz System Bus

Available at 2 GHz, 2.20 GHz, 2.26 GHz,

2.40 GHz, 2.50 GHz, 2.53 GHz, 2.60 GHz,

2.66 GHz, 2.80 GHz, 3 GHz, 3.06 GHz,

3.20 GHz, and 3.40 GHz

Supports Hyper-Threading Technology

(HT Technology) at 3.06 GHz with 533 MHz

system bus and all frequencies with 800 MHz

system bus

Binary compatible with applications running

on previous members of the Intel

microprocessor line

Intel NetBurst

microarchitecture

System bus frequency at 400 MHz, 533 MHz,

and 800 MHz

Rapid Execution Engine: Arithmetic Logic

Units (ALUs) run at twice the processor core

frequency

Hyper-Pipelined Technology

— Advance Dynamic Execution

— Very deep out-of-order execution

Enhanced branch prediction

Optimized for 32-bit applications running on

advanced 32-bit operating systems

8-KB Level 1 data cache

Level 1 Execution Trace Cache stores 12-K

micro-ops and removes decoder latency from

main execution loops

512-KB Advanced Transfer Cache (on-die,

full-speed Level 2 (L2) cache) with 8-way

associativity and Error Correcting Code

(ECC)

2-MB Integrated Level 3 (L3) cache with

8-way associativity that is supported by Intel

Pentium

4 Processor Extreme Edition

Supporting Hyper-Threading Technology

144 Streaming SIMD Extensions 2 (SSE2)

instructions

Enhanced floating point and multimedia unit

for enhanced video, audio, encryption, and

3D performance

Power Management capabilities

— System Management mode

— Multiple low-power states

8-way cache associativity provides improved

cache hit rate on load/store operations

478-Pin Package

The Intel

Pentium

4 processor family supporting Hyper-Threading Technology

(HT Technology) delivers Intel's most advanced, most powerful processors for desktop PCs and

entry-level workstations, which are based on the Intel NetBurst

microarchitecture. The

Pentium 4 processor is designed to deliver performance across applications and usages where

end-users can truly appreciate and experience the performance. These applications include

Internet audio and streaming video, image processing, video content creation, speech, 3D, CAD,

games, multimedia, and multitasking user environments. The Intel

Pentium

4 processor

Extreme Edition supporting HT Technology features 2 MB of L3 cache and offers high levels of

performance targeted specifically for high-end gamers and computing power users.

February 2004

Document Number: 298643-012

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

4 processor on 0.13 micron process may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Hyper-Threading Technology requires a computer system with an Intel

Pentium

4 processor supporting HT Technology and a Hyper-Threading

Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See

<<http://www.intel.com/info/hyperthreading/>> for more information including details on which processors support HT Technology.

Intel, Pentium, Intel NetBurst, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States

and other countries.

*Other names and brands may be claimed as the property of others.

Intel

Pentium

4 Processor on 0.13 Micron Process Datasheet

Contents

Introduction

.................................................................................................................. 9

1.1

1.2

Terminology.........................................................................................................11

1.1.1 Processor Packaging Terminology.........................................................11

References ..........................................................................................................12

System Bus and GTLREF ...................................................................................15

Power and Ground Pins ......................................................................................15

Decoupling Guidelines ........................................................................................16

2.3.1 VCC Decoupling .....................................................................................16

2.3.2 System Bus AGTL+ Decoupling.............................................................16

Voltage Identification ...........................................................................................16

2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18

Reserved, Unused Pins, and TESTHI[12:0]........................................................20

System Bus Signal Groups .................................................................................21

Asynchronous GTL+ Signals...............................................................................22

Test Access Port (TAP) Connection....................................................................22

System Bus Frequency Select Signals (BSEL[1:0])............................................22

Maximum Ratings................................................................................................23

Processor DC Specifications...............................................................................23

AGTL+ System Bus Specifications .....................................................................35

Package Load Specifications ..............................................................................40

Processor Insertion Specifications ......................................................................41

Processor Mass Specifications ...........................................................................41

Processor Materials.............................................................................................41

Processor Markings.............................................................................................42

Processor Pin Assignments ................................................................................45

Signal Descriptions..............................................................................................58

Processor Thermal Specifications.......................................................................68

5.1.1 Thermal Specifications ...........................................................................68

5.1.2 Thermal Metrology .................................................................................70

5.1.2.1 Processor Case Temperature Measurement ............................70

Power-On Configuration Options ........................................................................71

Clock Control and Low Power States..................................................................71

6.2.1 Normal State—State 1 ...........................................................................71

6.2.2 AutoHALT Powerdown State—State 2...................................................72

6.2.3 Stop-Grant State—State 3 .....................................................................73

6.2.4 HALT/Grant Snoop State—State 4 ........................................................73

6.2.5 Sleep State—State 5..............................................................................74

Electrical Specifications

........................................................................................15

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

Package Mechanical Specifications

.................................................................37

3.1

3.2

3.3

3.4

3.5

Pin Lists and Signal Descriptions

.....................................................................45

4.1

4.2

Thermal Specifications and Design Considerations

.................................67

5.1

Features

.......................................................................................................................71

6.1

6.2

Intel

Pentium

4 Processor on 0.13 Micron Process Datasheet

Figures

2-1

2-2

2-3

2-4

2-5

2-6

2-7

3-1

3-2

3-3

3-4

3-5

3-6

3-7

3-8

5-1

5-2

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

VID Pin Voltage and Current Requirements .................................................17

Typical VCCIOPLL, VCCA and VSSA Power Distribution ..................................19

Phase Lock Loop (PLL) Filter Requirements ......................................................19

Static and Transient Tolerance (For Intel

Pentium

Processor With 512-KB L2 Cache on 0.13 Micron Process)...............................29

Static and Transient Tolerance (For Intel

Pentium

Processor Extreme Edition Supporting Hyper-Threading Technology)...............31

ITPCLKOUT[1:0] Output Buffer Diagram ............................................................34

Test Circuit ..........................................................................................................35

Exploded View of Processor Components on a System Board ..........................37

Processor Package .............................................................................................38

Processor Cross-Section and Keep-In ................................................................39

Processor Pin Detail............................................................................................39

IHS Flatness Specification ..................................................................................40

Processor Markings (Processors with Fixed VID) ...............................................42

Processor Markings (Processors with Multiple VID) ...........................................42

The Coordinates of the Processor Pins As Viewed from the Top

of the Package ....................................................................................................43

Example Thermal Solution (Not to Scale) ...........................................................67

Guideline Locations for Case Temperature (TC) Thermocouple Placement ......70

Stop Clock State Machine ...................................................................................72

Mechanical Representation of the Boxed Processor ..........................................77

Side View Space Requirements for the Boxed Processor ..................................78

Top View Space Requirements for the Boxed Processor ...................................79

Boxed Processor Fan Heatsink Power Cable Connector Description.................80

MotherBoard Power Header Placement Relative to Processor Socket ..............81

Boxed Processor Fan Heatsink Airspace Keep-Out Requirements

(Side 1 View) .......................................................................................................82

Boxed Processor Fan Heatsink Airspace Keep-Out Requirements

(Side 2 View) .......................................................................................................83

Boxed Processor Fan Heatsink Set Points .........................................................83

Intel

Pentium

4 Processor on 0.13 Micron Process Datasheet

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