IC,SRAM,32KX8,CMOS,LDCC,32PIN,CERAMIC
Parameter Name | Attribute value |
Maker | Intel |
package instruction | QCCJ, LDCC32,.45X.7 |
Reach Compliance Code | unknow |
Maximum access time | 70 ns |
I/O type | COMMON |
JESD-30 code | R-XQCC-J32 |
JESD-609 code | e0 |
memory density | 262144 bi |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of terminals | 32 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 32KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.45X.7 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum standby current | 0.0008 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.125 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |