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G8870CI

Description
DTMF Signaling Circuit, CMOS, CDIP18,
CategoryWireless rf/communication    Telecom circuit   
File Size622KB,8 Pages
ManufacturerCalifornia Micro Devices
Download Datasheet Parametric View All

G8870CI Overview

DTMF Signaling Circuit, CMOS, CDIP18,

G8870CI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCalifornia Micro Devices
package instructionDIP, DIP18,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T18
JESD-609 codee0
Number of terminals18
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum slew rate7 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Telecom integrated circuit typesDTMF SIGNALING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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