Prescaler, 8690 Series, 1-Func, ECL, CDIP16, CERAMIC, DIP-16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Zarlink Semiconductor (Microsemi) |
package instruction | DIP, |
Reach Compliance Code | unknown |
Other features | +5V TTL OPERATION ALSO |
series | 8690 |
JESD-30 code | R-GDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | PRESCALER |
Number of data/clock inputs | 1 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | EMITTER FOLLOWER |
Output polarity | COMPLEMENTARY |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
propagation delay (tpd) | 9 ns |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
surface mount | NO |
technology | ECL |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
minfmax | 200 MHz |
SP8690ADG | SP8691ADG | SP8690BDG | |
---|---|---|---|
Description | Prescaler, 8690 Series, 1-Func, ECL, CDIP16, CERAMIC, DIP-16 | Prescaler, 8691 Series, 1-Func, ECL, CDIP16, CERAMIC, DIP-16 | Prescaler, 8690 Series, 1-Func, ECL, CDIP16, CERAMIC, DIP-16 |
Is it Rohs certified? | incompatible | incompatible | incompatible |
package instruction | DIP, | DIP, | DIP, |
Reach Compliance Code | unknown | unknown | unknown |
Other features | +5V TTL OPERATION ALSO | +5V TTL OPERATION ALSO | +5V TTL OPERATION ALSO |
series | 8690 | 8691 | 8690 |
JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
JESD-609 code | e0 | e0 | e0 |
Logic integrated circuit type | PRESCALER | PRESCALER | PRESCALER |
Number of data/clock inputs | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C |
Minimum operating temperature | -55 °C | -55 °C | -30 °C |
Output characteristics | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER |
Output polarity | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
propagation delay (tpd) | 9 ns | 9 ns | 9 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
surface mount | NO | NO | NO |
technology | ECL | ECL | ECL |
Temperature level | MILITARY | MILITARY | OTHER |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
width | 7.62 mm | 7.62 mm | 7.62 mm |
minfmax | 200 MHz | 200 MHz | 200 MHz |
Maker | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) |