SE-K250M4R70A3SW1012 datasheet, PDF

SE-K250M4R70A3SW1012: DescriptionAluminum Electrolytic Capacitor, Polarized, Aluminum (wet), 250V, 20% +Tol, 20% -Tol, 4.7uF, Through Hole Mount, ROHS COMPLIANT; CategoryPassive components capacitor; File Size60KB，3 Pages; ManufacturerYAGEO; Websitehttp://www.yageo.com/; Environmental Compliance

Download Datasheet Parametric View All

SE-K250M4R70A3SW1012 Overview

Aluminum Electrolytic Capacitor, Polarized, Aluminum (wet), 250V, 20% +Tol, 20% -Tol, 4.7uF, Through Hole Mount, ROHS COMPLIANT

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	YAGEO
package instruction	,
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	4.7 µF
Capacitor type	ALUMINUM ELECTROLYTIC CAPACITOR
dielectric materials	ALUMINUM (WET)
leakage current	0.0335 mA
Manufacturer's serial number	SE-K
Installation features	THROUGH HOLE MOUNT
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package shape	CYLINDRICAL PACKAGE
method of packing	TR
polarity	POLARIZED
positive tolerance	20%
Rated (DC) voltage (URdc)	250 V
ripple current	30 mA
surface mount	NO
Delta tangent	0.15
Terminal shape	WIRE

Design and implementation of RDS function based on S1473X: FM radio (FM) has always played a very important role in people's entertainment life. Many manufacturers engaged in consumer electronics design have embedded FM parts in products such as MP3, smart ph...; Jacktang RF/Wirelessly

【GD32450I-EVAL】Onboard SDRAM supports LittleVGL: Previous programs only supported internal RAM, which was too small for a 480*272 screen. To support the entire screen, a 480*272*4-byte space must be allocated, a total of 510K. The onboard chip ends ...; tinnu GD32 MCU

I recently debugged the Fudan Micro FM33LC026N chip and am preparing to trial-produce a batch. Are there any Fudan Micro agents?: I recently debugged the FM33LC026N chip and prepared to trial-produce a batch; I will first purchase 500 pieces....; y-ys Domestic Chip Exchange

Capacitor parallel ripple current: I would like to ask you, in the boost circuit, output capacitors C1 and C2 are connected in parallel, which one has a larger ripple current, C1 close to the switch or C2 close to the load? Please expl...; easthewj Switching Power Supply Study Group

MSP430 interrupt priority, open and close, interrupt nesting: 优先级顺序从高到低为：PORT2_VECTOR (1 * 2u) /* 0xFFE2 Port 2 */PORT1_VECTOR (4 * 2u) /* 0xFFE8 Port 1 */TIMERA1_VECTOR (5 * 2u) /* 0xFFEA Timer A CC1-2, TA */TIMERA0_VECTOR (6 * 2u) /* 0xFFEC Timer A CC0 */ADC_V...; 火辣西米秀 Microcontroller MCU

Is it necessary to use D1 bidirectional TVS in this circuit?: [i=s]This post was last edited by kal9623287 on 2022-7-18 13:53[/i]I saw a senior give a circuit, and after seeing it, I was a little curious and wanted to ask everyone in the forum, Is it necessary t...; kal9623287 Power technology

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components