CR12062.21KJ datasheet, PDF - EEWORLD Datasheet

CR12062.21KJ: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.25W, 2210ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP; CategoryPassive components The resistor; File Size2MB，3 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

Download Datasheet Parametric View All

CR12062.21KJ Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2210ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

Parameter Name	Attribute value
Maker	TT Electronics plc
package instruction	CHIP
Reach Compliance Code	compli
JESD-609 code	e0
Manufacturer's serial number	CR
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	155 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
method of packing	TR
Rated power dissipation(P)	0.25 W
Rated temperature	70 °C
resistance	2210 Ω
Resistor type	FIXED RESISTOR
size code	1206
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Terminal surface	TIN LEAD
Terminal shape	WRAPAROUND
Tolerance	5%
Operating Voltage	200 V

How reliable is Dupont wire???: [i=s]This post was last edited by lingking on 2019-5-5 22:26[/i] Some time ago, I used my STM32 development board to do an experiment to read BMP image files and display them on LCD. The effect was pr...; lingking DIY/Open Source Hardware

Konka's dual-HD flat panel won the China Consumer Electronics Innovation Design Award: [i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:59[/i]...; Felix Mobile and portable

Classic Books on Signal Integrity Design: "Signal Integrity Revealed: Dr. Yu's SI Design Notes" is based on the author's many years of engineering design and scientific research process. The book selects some extremely important content for e...; arui1999 Download Centre

How to avoid copper between the pins of AD18 chip: That's it...; lx331lx PCB Design

How to implement data exchange between FPGA and HPS on DE1-SOC development board? Free. Help can be 200 RMB: Realize data interaction between FPGA and HPS. Specifically, FPGA is used as the master to realize +1 function, and the data is stored on the HPS. How to do this kind of project in PS? The price is ne...; zihaodoingwork ARM Technology

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ