RGB TO YUV/IQ HIGH-SPEED MATRIX IC
| TA1287 | TA1287P | TA1287F | |
|---|---|---|---|
| Description | RGB TO YUV/IQ HIGH-SPEED MATRIX IC | RGB TO YUV/IQ HIGH-SPEED MATRIX IC | RGB TO YUV/IQ HIGH-SPEED MATRIX IC |
| Is it Rohs certified? | - | incompatible | incompatible |
| Maker | - | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | - | DIP | SOIC |
| package instruction | - | DIP, DIP16,.3 | SSOP, SOP16,.25,40 |
| Contacts | - | 16 | 16 |
| Reach Compliance Code | - | unknow | unknow |
| Commercial integrated circuit types | - | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
| JESD-30 code | - | R-PDIP-T16 | R-PDSO-G16 |
| length | - | 19.25 mm | 8.2 mm |
| Number of functions | - | 1 | 1 |
| Number of terminals | - | 16 | 16 |
| Maximum operating temperature | - | 65 °C | 65 °C |
| Minimum operating temperature | - | -20 °C | -20 °C |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | DIP | SSOP |
| Encapsulate equivalent code | - | DIP16,.3 | SOP16,.25,40 |
| Package shape | - | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | SMALL OUTLINE, SHRINK PITCH |
| power supply | - | 9 V | 9 V |
| Certification status | - | Not Qualified | Not Qualified |
| Maximum seat height | - | 4.45 mm | 1.9 mm |
| Maximum slew rate | - | 32 mA | 32 mA |
| Maximum supply voltage (Vsup) | - | 9.9 V | 9.9 V |
| Minimum supply voltage (Vsup) | - | 8.1 V | 8.1 V |
| surface mount | - | NO | YES |
| technology | - | BIPOLAR | BIPOLAR |
| Temperature level | - | COMMERCIAL | COMMERCIAL |
| Terminal form | - | THROUGH-HOLE | GULL WING |
| Terminal pitch | - | 2.54 mm | 1 mm |
| Terminal location | - | DUAL | DUAL |
| width | - | 7.62 mm | 4.6 mm |
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