IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC
Parameter Name | Attribute value |
Maker | STMicroelectronics |
Parts packaging code | QFP |
Contacts | 64 |
Reach Compliance Code | compli |
bit size | 8 |
CPU series | ST72 |
JESD-30 code | S-PQFP-G64 |
Number of terminals | 64 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP64,.6SQ,32 |
Package shape | SQUARE |
Package form | FLATPACK |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 1024 |
rom(word) | 32768 |
ROM programmability | MROM |
speed | 8 MHz |
Maximum slew rate | 12 mA |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
ST72P561R6T6/XXX | ST72P561K7T9/XXX | ST72P561R6T3/XXX | ST72P561R9T3/XXX | ST72P561R9T6/XXX | |
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Description | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP32, 7 X 7 MM, PLASTIC , LQFP-32 | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,ST72 CPU,CMOS,QFP,64PIN,PLASTIC |
Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Parts packaging code | QFP | QFP | QFP | QFP | QFP |
Contacts | 64 | 32 | 64 | 64 | 64 |
Reach Compliance Code | compli | unknown | compliant | compliant | compliant |
bit size | 8 | 8 | 8 | 8 | 8 |
JESD-30 code | S-PQFP-G64 | S-PQFP-G32 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
Number of terminals | 64 | 32 | 64 | 64 | 64 |
Maximum operating temperature | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | LQFP | QFP | QFP | QFP |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK | FLATPACK |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM programmability | MROM | MROM | MROM | MROM | MROM |
speed | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
CPU series | ST72 | - | ST72 | ST72 | ST72 |
Encapsulate equivalent code | QFP64,.6SQ,32 | - | QFP64,.6SQ,32 | QFP64,.6SQ,32 | QFP64,.6SQ,32 |
power supply | 5 V | - | 5 V | 5 V | 5 V |
RAM (bytes) | 1024 | - | 1024 | 2048 | 2048 |
rom(word) | 32768 | - | 32768 | 61440 | 61440 |
Maximum slew rate | 12 mA | - | 12 mA | 12 mA | 12 mA |