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KM23C4001-25

Description
MASK ROM, 512KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Categorystorage    storage   
File Size89KB,4 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KM23C4001-25 Overview

MASK ROM, 512KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

KM23C4001-25 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time250 ns
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.91 mm
memory density4194304 bi
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.04 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

KM23C4001-25 Related Products

KM23C4001-25 KM23C4001G-25 KM23C4001G-20 KM23C4001-20 KM23C4001-15 KM23C4001G-15
Description MASK ROM, 512KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 MASK ROM, 512KX8, 250ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 MASK ROM, 512KX8, 200ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 MASK ROM, 512KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG
Parts packaging code DIP SOIC SOIC DIP DIP SOIC
package instruction DIP, DIP32,.6 SOP, SOP32,.56 SOP, SOP32,.56 DIP, DIP32,.6 DIP, DIP32,.6 SOP, SOP32,.56
Contacts 32 32 32 32 32 32
Reach Compliance Code unknow unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 250 ns 250 ns 200 ns 200 ns 150 ns 150 ns
JESD-30 code R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32 R-PDIP-T32 R-PDSO-G32
JESD-609 code e0 e0 e0 e0 e0 e0
length 41.91 mm 20.47 mm 20.47 mm 41.91 mm 41.91 mm 20.47 mm
memory density 4194304 bi 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP SOP DIP DIP SOP
Encapsulate equivalent code DIP32,.6 SOP32,.56 SOP32,.56 DIP32,.6 DIP32,.6 SOP32,.56
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 3 mm 3 mm 5.08 mm 5.08 mm 3 mm
Maximum standby current 0.04 A 0.04 A 0.04 A 0.04 A 0.04 A 0.04 A
Maximum slew rate 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 11.43 mm 11.43 mm 15.24 mm 15.24 mm 11.43 mm

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