MASK ROM, 512KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | DIP |
package instruction | DIP, DIP32,.6 |
Contacts | 32 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 250 ns |
JESD-30 code | R-PDIP-T32 |
JESD-609 code | e0 |
length | 41.91 mm |
memory density | 4194304 bi |
Memory IC Type | MASK ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP32,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum standby current | 0.04 A |
Maximum slew rate | 0.04 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
KM23C4001-25 | KM23C4001G-25 | KM23C4001G-20 | KM23C4001-20 | KM23C4001-15 | KM23C4001G-15 | |
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Description | MASK ROM, 512KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | MASK ROM, 512KX8, 250ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | MASK ROM, 512KX8, 200ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | MASK ROM, 512KX8, 150ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
Parts packaging code | DIP | SOIC | SOIC | DIP | DIP | SOIC |
package instruction | DIP, DIP32,.6 | SOP, SOP32,.56 | SOP, SOP32,.56 | DIP, DIP32,.6 | DIP, DIP32,.6 | SOP, SOP32,.56 |
Contacts | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 250 ns | 250 ns | 200 ns | 200 ns | 150 ns | 150 ns |
JESD-30 code | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-G32 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
length | 41.91 mm | 20.47 mm | 20.47 mm | 41.91 mm | 41.91 mm | 20.47 mm |
memory density | 4194304 bi | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | DIP | DIP | SOP |
Encapsulate equivalent code | DIP32,.6 | SOP32,.56 | SOP32,.56 | DIP32,.6 | DIP32,.6 | SOP32,.56 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 3 mm | 3 mm | 5.08 mm | 5.08 mm | 3 mm |
Maximum standby current | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
Maximum slew rate | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 11.43 mm | 11.43 mm | 15.24 mm | 15.24 mm | 11.43 mm |