Flash, PBGA44, 7.70 X 6.20 MM, 0.50 MM PITCH, LEAD FREE, FBGA-44
Parameter Name | Attribute value |
Maker | SAMSUNG |
Parts packaging code | BGA |
package instruction | 7.70 X 6.20 MM, 0.50 MM PITCH, LEAD FREE, FBGA-44 |
Contacts | 44 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
JESD-30 code | R-PBGA-B44 |
Memory IC Type | FLASH |
Number of terminals | 44 |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Programming voltage | 1.8 V |
surface mount | YES |
Terminal form | BALL |
Terminal location | BOTTOM |