K8P3315UQB-EE4B0 datasheet, PDF

K8P3315UQB-EE4B0: DescriptionFlash, 2MX16, 60ns, PBGA64,; Categorystorage storage; File Size1MB，53 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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K8P3315UQB-EE4B0 Overview

Flash, 2MX16, 60ns, PBGA64,

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
package instruction	BGA, BGA64,8X8,40
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	60 ns
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	S-PBGA-B64
memory density	33554432 bi
Memory IC Type	FLASH
memory width	16
Number of departments/size	16,62
Number of terminals	64
word count	2097152 words
character code	2000000
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	SQUARE
Package form	GRID ARRAY
page size	8 words
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Certification status	Not Qualified
ready/busy	YES
Department size	4K,32K
Maximum standby current	0.00003 A
Maximum slew rate	0.055 mA
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
switch bit	YES
type	NOR TYPE

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