Flash, 2MX16, 65ns, PBGA64, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-64
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | SAMSUNG |
| Parts packaging code | BGA |
| package instruction | TBGA, BGA64,8X8,40 |
| Contacts | 64 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 65 ns |
| startup block | BOTTOM/TOP |
| command user interface | YES |
| Universal Flash Interface | YES |
| Data polling | YES |
| JESD-30 code | R-PBGA-B64 |
| length | 13 mm |
| memory density | 33554432 bi |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of departments/size | 16,62 |
| Number of terminals | 64 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TBGA |
| Encapsulate equivalent code | BGA64,8X8,40 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE |
| page size | 8 words |
| Parallel/Serial | PARALLEL |
| power supply | 3/3.3 V |
| Programming voltage | 2.7 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Maximum seat height | 1.2 mm |
| Department size | 4K,32K |
| Maximum standby current | 0.00003 A |
| Maximum slew rate | 0.055 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| switch bit | YES |
| type | NOR TYPE |
| width | 11 mm |
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