Flash, 2MX16, 80ns, LEAD FREE, FBGA
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | SAMSUNG |
| Parts packaging code | BGA |
| package instruction | BGA, |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum access time | 80 ns |
| JESD-30 code | R-PBGA-B |
| JESD-609 code | e1 |
| memory density | 33554432 bi |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Programming voltage | 1.8 V |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 1.95 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN SILVER COPPER |
| Terminal form | BALL |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
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