Flash, 8MX16, 70ns, PBGA64, 9 X 9 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TBGA-64
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | SAMSUNG |
| Parts packaging code | BGA |
| package instruction | VFBGA, |
| Contacts | 64 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Maximum access time | 70 ns |
| Other features | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
| JESD-30 code | S-PBGA-B64 |
| JESD-609 code | e1 |
| length | 9 mm |
| memory density | 134217728 bi |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 2 |
| Number of functions | 1 |
| Number of terminals | 64 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Programming voltage | 1.8 V |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Maximum supply voltage (Vsup) | 1.95 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
| width | 9 mm |
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