IC,FIBER-OPTIC TRANSCEIVER,BGA,256PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
package instruction | BGA, BGA256,20X20,50 |
Reach Compliance Code | unknow |
JESD-30 code | S-PBGA-B256 |
Number of terminals | 256 |
Maximum operating temperature | 95 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA256,20X20,50 |
Package shape | SQUARE |
Package form | GRID ARRAY |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum slew rate | 925 mA |
Nominal supply voltage | 3.3 V |
surface mount | YES |
Temperature level | OTHER |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
VSC7216UC-01 | VSC7216XUC-01 | |
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Description | IC,FIBER-OPTIC TRANSCEIVER,BGA,256PIN,PLASTIC | Telecom IC, PBGA256, |
Maker | Microsemi | Microsemi |
package instruction | BGA, BGA256,20X20,50 | BGA, BGA256,20X20,50 |
Reach Compliance Code | unknow | compliant |
JESD-30 code | S-PBGA-B256 | S-PBGA-B256 |
Number of terminals | 256 | 256 |
Maximum operating temperature | 95 °C | 95 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA |
Encapsulate equivalent code | BGA256,20X20,50 | BGA256,20X20,50 |
Package shape | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY |
power supply | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified |
Maximum slew rate | 925 mA | 925 mA |
Nominal supply voltage | 3.3 V | 3.3 V |
surface mount | YES | YES |
Temperature level | OTHER | OTHER |
Terminal form | BALL | BALL |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | BOTTOM |