Time Slot Assigner, PBGA217, PLASTIC, BGA-217
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | LSC/CSI |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 217 |
Reach Compliance Code | compli |
JESD-30 code | S-PBGA-B217 |
JESD-609 code | e0 |
length | 23 mm |
Number of functions | 1 |
Number of terminals | 217 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
Certification status | Not Qualified |
Maximum seat height | 2.13 mm |
Nominal supply voltage | 3.3 V |
surface mount | YES |
Telecom integrated circuit types | TIME SLOT ASSIGNER |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |
T8100---BAL | T8100---SC | |
---|---|---|
Description | Time Slot Assigner, PBGA217, PLASTIC, BGA-217 | Time Slot Assigner, CMOS, PQFP208, |
Is it lead-free? | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible |
Maker | LSC/CSI | LSC/CSI |
Parts packaging code | BGA | QFP |
package instruction | BGA, | QFP, QFP208,1.2SQ,20 |
Contacts | 217 | 208 |
Reach Compliance Code | compli | unknow |
JESD-30 code | S-PBGA-B217 | S-PQFP-G208 |
JESD-609 code | e0 | e0 |
Number of functions | 1 | 1 |
Number of terminals | 217 | 208 |
Maximum operating temperature | 85 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | QFP |
Package shape | SQUARE | SQUARE |
Package form | GRID ARRAY | FLATPACK |
Certification status | Not Qualified | Not Qualified |
Nominal supply voltage | 3.3 V | 3.3 V |
surface mount | YES | YES |
Telecom integrated circuit types | TIME SLOT ASSIGNER | TIME SLOT ASSIGNER |
Temperature level | INDUSTRIAL | COMMERCIAL |
Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) |
Terminal form | BALL | GULL WING |
Terminal pitch | 1.27 mm | 0.5 mm |
Terminal location | BOTTOM | QUAD |