Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | LOGIC Devices |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 24 |
Reach Compliance Code | unknow |
ECCN code | 3A001.A.2.C |
Maximum access time | 35 ns |
Other features | AUTOMATIC POWER-DOWN |
JESD-30 code | R-CDIP-T24 |
length | 30.48 mm |
memory density | 262144 bi |
Memory IC Type | STANDARD SRAM |
memory width | 4 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 24 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 64KX4 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 4.953 mm |
Minimum standby current | 2 V |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |