EEWORLDEEWORLDEEWORLD

Part Number

Search

CDR03BX223BMUS

Description
Ceramic Capacitor, Multilayer, Ceramic, 100V, 20% +Tol, 20% -Tol, BX, 15% TC, 0.022uF, Surface Mount, 1808, CHIP
CategoryPassive components    capacitor   
File Size970KB,10 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

CDR03BX223BMUS Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 20% +Tol, 20% -Tol, BX, 15% TC, 0.022uF, Surface Mount, 1808, CHIP

CDR03BX223BMUS Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerKEMET
package instruction, 1808
Reach Compliance Code_compli
ECCN codeEAR99
capacitance0.022 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.295 mm
JESD-609 codee0
length4.57 mm
Manufacturer's serial numberCDR03
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 7 INCH
positive tolerance20%
Rated (DC) voltage (URdc)100 V
GuidelineMIL-PRF-55681
seriesC(SIZE)P
size code1808
surface mountYES
Temperature characteristic codeBX
Temperature Coefficient15% ppm/°C
Terminal surfaceTin/Lead (Sn70Pb30) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width2.03 mm
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
CHIP DIMENSIONS
“SOLDERGUARD I” *
SOLDER
“SOLDERGUARD II”
TINNED
W
T
L
BW
NICKEL
ELECTRODES
SILVER
METALLIZATION
ELECTRODES
NICKEL
SILVER
METALLIZATION
Military Designation - “S” or “U”
KEMET Designation - “H”
Military Designation - “W” or “Y”
KEMET Designation - “C”
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE
KEMET
SIZE
CODE
T
L
W
MIN.
MAX.
BW
CDR01
CDR02
CDR03
CDR04
CDR05
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C0805
C1805
C1808
C1812
C1825
C2225
C0805
C1206
C1210
C1812
C1825
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
+.51
+.020
4.57
.180
–.38
–.015
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
(
)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
+.51
+.020
6.35
.250
–.38
–.015
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
.51 (.020)
.51 (.020)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
2.03 (.080)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
(
)
Note: For Solderguard I (MIL-C55681 “S” or “U” Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Width/Thickness
Length
CDR01
0.51MM (.020)
0.38MM (.015)
CDR02-06
0.64MM (.025)
0.38MM (.015)
CDR31-35
0.60MM (.023)
0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B P
101 B K
S M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
FAILURE RATE LEVEL
(%/1000 hrs.)
TERMINATION FINISH
S — Solder Coated, Final
(SolderGuard I)
U — Base Metalization—
Barrier Metal—Solder
Coated (SolderGuard I)
W — Base Metalization—
Barrier Metal—Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin) Solderguard II
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
CAPACITANCE TOLERANCE
B
C
D
F
±.1 pF ±.25 pF ±.5 pF ±1%
J
±5%
K
M
±10% ±20%
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P 101 K
1 G M C*
CERAMIC
SIZE CODE
See Table Above
END METALIZATION
C — SolderGuard II
(100% Sn)
(Military equiv: Y, W)
H — SolderGuard I
(Sn60)
(Military equiv: S, U)
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
FAILURE RATE
(%/1,000 hrs.)
M — 1.0
P — 0.1
R — 0.01
S — 0.001
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±
.1 pF
±
.25 pF
±
.5 pF
±
1%
±
5%
±
10%
±
20%
VOLTAGE
1 — 100V, 5 — 50V
* Part Number Example: C0805P101K1GMC
(14 digits - no spaces)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
87
Ceramic Surface Mount
M — 1.0
P — 0.1
R — 0.01
S — 0.001
Issues that need attention when initializing SPI of C2000 series 280049 chip
When the 280049 chip uses TI's library function, the register settings do not change after SPIA initialization, all are 0. At this time, you need to enable SPIA or SPIB. This problem has troubled me f...
fish001 Microcontroller MCU
[Power amplifier case] Application of power amplifier based on voice coil motor test system design
[Power amplifier case] Application of power amplifier based on voice coil motor test system designThis experiment aims to Based on the voice coil motor direct drive water hydraulic control valve Impro...
aigtekatdz Test/Measurement
Application of ISD4004 voice chip in voice station announcer
Abstract: ISD4004 voice chip series is a product launched by ISD Company of the United States. It has the characteristics of multiple recording and playback, long storage time, no need to expand the m...
frozenviolet Automotive Electronics
What are the differences between SS14 SS24 SS34 Schottky diodes and ordinary diodes and how to distinguish the positive and negative poles?
[b][b][color=rgb(51, 51, 51)][font=微软雅黑][size=18pt]What is the difference between SS14 SS24 SS34? [/size][/font][/color][/b][b][color=rgb(51, 51, 51)][/color][/b][/b][align=left][color=rgb(51, 51, 51)...
bqgup Innovation Lab
How to use Bluetooth 4.2 to implement the Internet of Things
In many wireless IoT devices, such as wearable electronics and battery-powered or self-powered sensors, it is critical to keep power consumption to a minimum. Some of the most important applications f...
Jacktang RF/Wirelessly
What can the PG pin of CH221K be used for?
@USB MCUThe specification says PG, Power Good, low level is valid, and the function can be customized. ------------ Is there any example for this custom functionality? Can it be used to make an indica...
韵湖葱白 Special Edition for Assessment Centres

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号