CERAMIC CHIP/CAPACITORS
Tin Lead L Termination
FEATURES
KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the
commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead elec-
troplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the
electronics industry marches to RoHS compliance it is important that KEMET provide the Tin/Lead terminated products for
our valued high reliability and military customers.
KEMET Tin/Lead MLCC surface mount capacitors are available in standard EIA case sizes from 0402 to 2225 and standard
KEMET Tiin/Lead MLCC surface mount capacitors are available
range from 6.3V to 200V. To order the Tin/Lead
and standard
capacitance values in X7R and C0G dielectrics. Voltage ratings
in standard EIA case sizes from 0402 to 2225
terminations
th
capacitance values in X7R, X5R,
the part number.
Voltage ratings
L Series termination
200V. To order the Tin/Lead termina-
(Open
indicate an “L” in the 14 digit of
C0G dielectrics.
To request the
range from 6.3V to
for other surface mount product lines
tions indicate an “L” in the 14
th
digit of the part number. For additional dielectrics and voltage ratings please contact
local Sales
Mode, High Voltage, Arrays, etc.) or for additional dielectrics and higher voltage ratings, please contact the factory or
the fac-
tory or local Sales personnel.
representative.
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
NICKEL PLATE
CONDUCTIVE METALLIZATION
Sn/Pb
PLATE
DIMENSIONS—MILLIMETERS AND (INCHES)
EIA
SIZE CODE
0402*
0603*
0805*
1206*
1210*
1812
1825*
2220
2225
METRIC
SIZE CODE
(Ref only)
1005
1608
2012
3216
3225
4532
4564
5650
5664
L#
LENGTH
1.0 (.04) ± .05(.002)
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
W#
WIDTH
0.5 (.02) ± .05 (.002)
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
B
BANDWIDTH
0.20 (0.008)-0.40 (0.016)
S
MIN. SEPARATION
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
See page 77
for thickness
dimensions.
0.35 (.014) ±0.15 (.006)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
Solder Wave
†
or
Solder Reflow
Solder
Reflow
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 96.)
† For extended value 1210 case size – solder reflow only.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A L*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
G – ±2%
* Part Number Example: C0805C103K5RAL
Military see page 86)
END METALLIZATION
L - SnPb plated nickel barrier
(SnPb 5% minimum)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P – X5R (±15%) (-55°C + 85°C)
VOLTAGE
1 - 100V
3 - 25V
2 - 200V
4 - 16V
5 - 50V
8 - 10V
9 - 6.3V
(14 digits - no spaces)
76
Refer to pages 72-75 for NP0/C0G, X7R and X5R dielectric capacitance ranges available.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
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