|
CLC425ALC |
5962-9325901 |
5962-9325901MPA |
CLC425 |
CLC425AJE |
CLC425AJM5 |
CLC425AJP |
Description |
OP-AMP, 1000 uV OFFSET-MAX, CDIP8 |
OP-AMP, 1000 uV OFFSET-MAX, CDIP8 |
OP-AMP, 1000 uV OFFSET-MAX, CDIP8 |
OP-AMP, 1000 uV OFFSET-MAX, CDIP8 |
OP-AMP, 1000 uV OFFSET-MAX, CDIP8 |
OP-AMP, 800 uV OFFSET-MAX, 1900 MHz BAND WIDTH, PDSO5 |
OP-AMP, 1000 uV OFFSET-MAX, CDIP8 |
Maker |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
Parts packaging code |
WAFER |
- |
DIP |
- |
SOIC |
SOT-23 |
DIP |
package instruction |
, DIE OR CHIP |
- |
CERAMIC, DIP-8 |
- |
SOP, SOP8,.25 |
LSSOP, TSOP5/6,.11,37 |
DIP, DIP8,.3 |
Reach Compliance Code |
unknow |
- |
unknown |
- |
unknow |
unknow |
unknow |
ECCN code |
EAR99 |
- |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
Amplifier type |
OPERATIONAL AMPLIFIER |
- |
OPERATIONAL AMPLIFIER |
- |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
Architecture |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
Maximum average bias current (IIB) |
20 µA |
- |
40 µA |
- |
40 µA |
20 µA |
20 µA |
Maximum bias current (IIB) at 25C |
20 µA |
- |
20 µA |
- |
20 µA |
20 µA |
20 µA |
Nominal Common Mode Rejection Ratio |
100 dB |
- |
92 dB |
- |
100 dB |
100 dB |
100 dB |
frequency compensation |
YES (AVCL>=10) |
- |
YES (AVCL>=10) |
- |
YES (AVCL>=10) |
YES (AVCL>=10) |
YES (AVCL>=10) |
Maximum input offset voltage |
800 µV |
- |
1000 µV |
- |
800 µV |
800 µV |
800 µV |
JESD-30 code |
X-XUUC-N |
- |
R-GDIP-T8 |
- |
R-PDSO-G8 |
R-PDSO-G5 |
R-PDIP-T8 |
low-dissonance |
NO |
- |
NO |
- |
NO |
NO |
NO |
Negative supply voltage upper limit |
-7 V |
- |
-7 V |
- |
-7 V |
-7 V |
-7 V |
Nominal Negative Supply Voltage (Vsup) |
-5 V |
- |
-5 V |
- |
-5 V |
-5 V |
-5 V |
Number of functions |
1 |
- |
1 |
- |
1 |
1 |
1 |
Maximum operating temperature |
125 °C |
- |
125 °C |
- |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-55 °C |
- |
-55 °C |
- |
-40 °C |
-40 °C |
-40 °C |
Package body material |
UNSPECIFIED |
- |
CERAMIC, GLASS-SEALED |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Encapsulate equivalent code |
DIE OR CHIP |
- |
DIP8,.3 |
- |
SOP8,.25 |
TSOP5/6,.11,37 |
DIP8,.3 |
Package shape |
UNSPECIFIED |
- |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
UNCASED CHIP |
- |
IN-LINE |
- |
SMALL OUTLINE |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
IN-LINE |
power supply |
+-5 V |
- |
+-5 V |
- |
+-5 V |
+-5 V |
+-5 V |
Programmable power |
YES |
- |
YES |
- |
YES |
YES |
YES |
Certification status |
Not Qualified |
- |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Nominal slew rate |
350 V/us |
- |
350 V/us |
- |
350 V/us |
350 V/us |
350 V/us |
Maximum slew rate |
16 mA |
- |
18 mA |
- |
18 mA |
18 mA |
18 mA |
Supply voltage upper limit |
7 V |
- |
7 V |
- |
7 V |
7 V |
7 V |
Nominal supply voltage (Vsup) |
5 V |
- |
5 V |
- |
5 V |
5 V |
5 V |
surface mount |
YES |
- |
NO |
- |
YES |
YES |
NO |
technology |
BIPOLAR |
- |
BIPOLAR |
- |
BIPOLAR |
BIPOLAR |
BIPOLAR |
Temperature level |
MILITARY |
- |
MILITARY |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
NO LEAD |
- |
THROUGH-HOLE |
- |
GULL WING |
GULL WING |
THROUGH-HOLE |
Terminal location |
UPPER |
- |
DUAL |
- |
DUAL |
DUAL |
DUAL |
Nominal Uniform Gain Bandwidth |
1900 kHz |
- |
1900000 kHz |
- |
1900000 kHz |
1900000 kHz |
1900000 kHz |
Minimum voltage gain |
20000 |
- |
- |
- |
7070 |
7070 |
7100 |
broadband |
YES |
- |
YES |
- |
YES |
YES |
YES |
Is it Rohs certified? |
- |
- |
incompatible |
- |
incompatible |
incompatible |
incompatible |
Contacts |
- |
- |
8 |
- |
8 |
5 |
8 |
JESD-609 code |
- |
- |
e0 |
- |
e0 |
e0 |
e0 |
Number of terminals |
- |
- |
8 |
- |
8 |
5 |
8 |
encapsulated code |
- |
- |
DIP |
- |
SOP |
LSSOP |
DIP |
Peak Reflow Temperature (Celsius) |
- |
- |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Maximum seat height |
- |
- |
4.57 mm |
- |
1.75 mm |
1.45 mm |
5.08 mm |
Terminal surface |
- |
- |
Tin/Lead (Sn/Pb) - hot dipped |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal pitch |
- |
- |
2.54 mm |
- |
1.27 mm |
0.95 mm |
2.54 mm |
Maximum time at peak reflow temperature |
- |
- |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
- |
- |
7.62 mm |
- |
3.9 mm |
1.65 mm |
7.62 mm |