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C0805H124F3GACTU

Description
Surface Mount Ceramic Chip Capacitors High Temperature 200ºC C0G MLCC
File Size531KB,6 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
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C0805H124F3GACTU Overview

Surface Mount Ceramic Chip Capacitors High Temperature 200ºC C0G MLCC

Product Bulletin
Surface Mount Ceramic Chip Capacitors
High Temperature 200ºC C0G MLCC
No Piezoelectric Noise.
Extremely low ESR and ESL.
High Thermal Stability.
High Ripple Current Capability.
Preferred capacitance solution at line frequencies and into the MHz range.
No capacitance change with respect to applied rated DC voltage.
Minimal capacitance change with respect to temperature from -55ºC to +200ºC.
No capacitance decay with time.
Non-polar device.
Benefits and Features:
Typical applications include critical timing, tuning, circuits requiring low loss,
circuits with pulse, high current, decoupling, by-pass,
ltering, transient voltage
suppression, blocking and energy storage for use in extreme environments com-
monly present in applications such as down-hole exploration, aerospace engine
compartments and geophysical probes.
.
Applications:
KEMET’s New High Temperature Surface Mount C0G MLCCs feature a robust and proprietary base metal
dielectric system that offers industry-leading performance relative to capacitance and case size combined with
capacitance stability at extreme temperatures up to +200ºC. This new platform promotes downsizing opportu-
nities of existing High Temperature C0G technology, and offers replacement opportunities of existing X7R/BX/
BR technologies.
Standard capacitance ratings for these devices range from 0.5 pF up to 0.22
μF
in capacitance tolerance offer-
ings of ±0.25pF, ±0.5pF, ±1%, ±2%, ±5%, ±10%, or ±20%. The Temperature Coefficient of Capacitance (TCC)
is ±30ppm/°C from -55°C to +200°. Devices are available in DC voltage ratings of 10V, 16V, 25V, 50V and
100V, with a maximum dissipation factor of 0.10%. Seven standard EIA case size options are available which
include –0603, 0805, 1206, 1210, and 1812- with either nickel barrier/tin or Sn/Pb terminations.
Outline Drawing
Dimensions - Millimeters (Inches)
EIA SIZE
CODE
0603
0805
1206
1210
1812
METRIC
SIZE CODE
1608
2012
3216
3225
4532
L
LENGTH
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
W
WIDTH
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
3.2 (.126) ± .30 (.012)
B
BANDWIDTH
0.35 (.014) ± .15 (.006)
0.50 (.020) ± .25 (.010)
0.50 (.020) ± .25 (.010)
0.50 (.020) ± .25 (.010)
0.60 (.024) ± .35 (.014)
S
SEPARATION
minimum
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F4002 01/10

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