|
AT25DF021-MH-T |
AT18F002-30XU |
AT18F040-30XU |
AT25DF021-MHF-T |
AT25DF021-SSHF-B |
Description |
2-Megabit 2.3-volt or 2.7-volt Minimum SPI Serial Flash Memory |
FPGA Configuration Flash Memory |
FPGA Configuration Flash Memory |
2-Megabit 2.3-volt or 2.7-volt Minimum SPI Serial Flash Memory |
2-Megabit 2.3-volt or 2.7-volt Minimum SPI Serial Flash Memory |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Atmel (Microchip) |
Parts packaging code |
SON |
TSSOP |
TSSOP |
SON |
SOIC |
package instruction |
VSON, SOLCC8,.25 |
TSSOP, TSSOP20,.25 |
TSSOP, TSSOP20,.25 |
VSON, SOLCC8,.25 |
SOP, SOP8,.25 |
Contacts |
8 |
20 |
20 |
8 |
8 |
Reach Compliance Code |
unknow |
unknow |
unknow |
unknow |
compli |
ECCN code |
3A991.B.1.B.1 |
EAR99 |
EAR99 |
3A991.B.1.B.1 |
3A991.B.1.B.1 |
Maximum clock frequency (fCLK) |
70 MHz |
33 MHz |
33 MHz |
50 MHz |
50 MHz |
JESD-30 code |
R-XDSO-N8 |
R-PDSO-G20 |
R-PDSO-G20 |
R-XDSO-N8 |
R-PDSO-G8 |
length |
6 mm |
6.5 mm |
6.5 mm |
6 mm |
4.925 mm |
memory density |
2097152 bi |
2097152 bi |
4194304 bi |
2097152 bi |
2097152 bi |
Memory IC Type |
FLASH |
CONFIGURATION MEMORY |
CONFIGURATION MEMORY |
FLASH |
FLASH |
memory width |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
20 |
20 |
8 |
8 |
word count |
2097152 words |
2097152 words |
4194304 words |
2097152 words |
2097152 words |
character code |
2000000 |
2000000 |
4000000 |
2000000 |
2000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
2MX1 |
2MX1 |
4MX1 |
2MX1 |
2MX1 |
Package body material |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
PLASTIC/EPOXY |
encapsulated code |
VSON |
TSSOP |
TSSOP |
VSON |
SOP |
Encapsulate equivalent code |
SOLCC8,.25 |
TSSOP20,.25 |
TSSOP20,.25 |
SOLCC8,.25 |
SOP8,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
power supply |
3/3.3 V |
3.3 V |
3.3 V |
2.5/3.3 V |
2.5/3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
0.6 mm |
1.2 mm |
1.2 mm |
0.6 mm |
1.75 mm |
Maximum standby current |
0.000025 A |
0.001 A |
0.001 A |
0.000025 A |
0.000025 A |
Maximum slew rate |
0.02 mA |
0.01 mA |
0.01 mA |
0.02 mA |
0.02 mA |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
3 V |
3 V |
2.3 V |
2.3 V |
Nominal supply voltage (Vsup) |
3 V |
3.3 V |
3.3 V |
3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
NO LEAD |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
Terminal pitch |
1.27 mm |
0.65 mm |
0.65 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
type |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
width |
5 mm |
4.4 mm |
4.4 mm |
5 mm |
3.9 mm |
Data retention time - minimum |
20 |
- |
- |
20 |
20 |
Durability |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
- |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
JESD-609 code |
e4 |
- |
- |
e4 |
e4 |
Programming voltage |
2.7 V |
- |
- |
2.7 V |
2.7 V |
Serial bus type |
SPI |
- |
- |
SPI |
SPI |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
write protect |
HARDWARE/SOFTWARE |
- |
- |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |