ACAC 0612, ACAS 0612 - Professional
Vishay Beyschlag
Professional Thin Film Chip Resistor Array
FEATURES
•
Advanced thin film technology
•
Two pairs or four equal resistor values
•
TCR down to ± 25 ppm/K
•
Tolerance down to ± 0.5 %
•
Pure Sn termination on Ni barrier layer
•
RoHS compliant component, compatible with lead (Pb)-free
and lead containing soldering processes
ACAC 0612 (concave terminations) and ACAS 0612 (convex
terminations) thin chip resistor arrays combine the proven
reliability of professional thin film chip resistor products with
the advantages of chip resistor arrays. A small package
enables the design of high density circuits in combination
with reduction of assembly costs. Four equal resistor values
or two pairs are available.
APPLICATIONS
•
Voltage divider
•
Feedback circuits
•
Signal conditioning
•
Bus terminations
TECHNICAL SPECIFICATIONS
DESCRIPTION
EIA size
Metric size
Configuration, isolated
Design:
All Equal
Two Pairs
Resistance values
Absolute tolerance
(2)
Absolute temperature coefficient
(2)
Max. resistance ratio
R
min.
/R
max.
Rated dissipation:
P
70 (4)
Element
Package, 4 x 0603
Operating voltage
Film temperature
Insulation voltage (U
ins
) against ambient and between isolated
resistors, continuous
0.1 W
0.3 W
75 V
125
°C
75 V
AE
TP
47
Ω
to 221 kΩ
(1)
± 1 %; ± 0.5 %
± 50 ppm/K; ± 25 ppm/K
1:10
(3)
ACAC 0612, ACAS 0612
0612
RR1632M
4 x 0603
Notes
(1)
Resistance values to be selected from E24, E48 and E96
(2)
For TCR tracking, tolerance matching and tighter absolute tolerance please refer to data sheet “Precision Thin Film Chip Resistor Array“
available on our web site at www.vishay.com
(3)
Higher resistance ratio is available on request
(4)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat-flow support of the printed
circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high
level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board
materials may be required to maintain the reliability of the assembly.
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
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Document Number: 28754
Revision: 11-Sep-08
ACAC 0612, ACAS 0612 - Professional
Professional Thin Film Chip Resistor Array
Vishay Beyschlag
PART NUMBER AND PRODUCT DESCRIPTION
(1)
PART NUMBER: ACASA110012200P500
A
C
A
S
A
1
1
0
0
1
2
2
0
0
P
5
0
0
MODEL
ACA
TERMINAL
C
= Concave
S
= Convex
SIZE
A
= 0612
RESISTANCE
VALUE
(2) (3)
3 digit
resistance
value R1, R4
1 digit multiplier
MULTIPLIER
9
= *10
-1
0
= *10
0
1
= *10
1
2
= *10
2
3
= *10
3
ACCURACY
GRADE
(4)
TCR and
Tolerance
1
2
3
RESISTANCE
VALUE
(2) (3)
3 digit
resistance
value R2, R3
1 digit multiplier
MULTIPLIER
9
= *10
-1
0
= *10
0
1
= *10
1
2
= *10
2
3
= *10
3
PACKAGING
(5)
P1
P5
PW
SPECIAL
00
= Standard
PRODUCT DESCRIPTION: ACAS 0612 110R 1 220R P5
ACA
MODEL
ACA
= Chip Array
S
TERMINATION
C
= Concave
S
= Convex
0612
SIZE
0612
110R
RESISTANCE
VALUE R1, R4
(2) (3)
110R
= 110
Ω
1K1
= 1.1 kΩ
22K1
= 22.1 kΩ
1
ACCURACY
GRADE
(4)
TCR and
Tolerance
1
2
3
220R
RESISTANCE
VALUE R2, R3
(2) (3)
220R
= 220
Ω
1K1
= 1.1 kΩ
22K1
= 22.1 kΩ
P5
PACKAGING
(5)
P1
P5
PW
Notes
(1)
Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
(2)
R = R
≤
R = R ; please refer to APPLICATION INFORMATION, see below
1
4
2
3
(3)
Different resistance values are available on request
(4)
Please refer to table TEMPERATURE COEFFICIENT AND RESISTANCE RANGE, see below
(5)
Please refer to table PACKAGING, see below
PACKAGING
MODEL
ACAC 0612
ACAS 0612
TAPE WIDTH
8 mm
8 mm
8 mm
DIAMETER
180 mm/7"
180 mm/7"
330 mm/13"
PIECES
1000
5000
10 000
PITCH
4 mm
4 mm
4 mm
PACKAGING CODE
PAPER TAPE
P1
P5
PW
DIMENSIONS ACAC 0612
in millimeters
W
T
I
1
T
1
W
T
I
2
T
2
Top view
Bottom view
DIMENSIONS
- chip resistor array, mass and relevant physical dimensions
TYPE
ACAC 0612
L
(mm)
W
(mm)
H
(mm)
P
(mm)
W
T
(mm)
T
1
(mm)
T
2
(mm)
d
(mm)
l
1
(mm)
l
2
(mm)
MASS
(mg)
9.53
1.6 ± 0.15 3.2 ± 0.15 0.55 ± 0.1 0.8 ± 0.1 0.5 ± 0.15 0.3 ± 0.15 0.4 ± 0.15 0.3 ± 0.1 min. 0.15 min. 0.25
For technical questions, contact: filmresistors.thinfilmarray@vishay.com
Document Number: 28754
Revision: 11-Sep-08
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269
ACAC 0612, ACAS 0612 - Professional
Vishay Beyschlag
Professional Thin Film Chip Resistor Array
DIMENSIONS ACAS 0612
in millimeters
A
T
2
T
1
H
A
1
A
DIMENSIONS
- chip resistor array, mass and relevant physical dimensions
TYPE
ACAS 0612
W
(mm)
1.5 ± 0.15
L
(mm)
3.2 ± 0.15
H
(mm)
0.45 ± 0.1
P
(mm)
0.8 ± 0.1
A
1
(mm)
0.6 ± 0.15
A
(mm)
0.4 ± 0.15
T
1
(mm)
0.3 ± 0.15
T
2
(mm)
0.4 ± 0.15
MASS
(mg)
6.59
PATTERN STYLES FOR CHIP RESISTOR ARRAYS
ACAC 0612
0.1
Y
Z
G
Y
G
Z
ACAS 0612
U
I
X
Dimensions in mm
limits for solder resistance
X
I
P
P
0.1
RECOMMENDED SOLDER PAD DIMENSIONS FOR CHIP RESISTOR ARRAYS
TYPE
ACAC 0612
ACAS 0612
G (mm)
0.7
0.8
Y (mm)
0.7
1.15
X (mm)
0.5
0.64
U (mm)
-
0.44
Z (mm)
2.1
3.1
I (mm)
0.3
0.36
P (mm)
0.8
0.8
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
DESCRIPTION
ACCURACY GRADE
1
2
3
ABSOLUTE TCR
± 25 ppm/K
± 50 ppm/K
± 50 ppm/K
ABSOLUTE TOLERANCE
± 0.5 %
± 0.5 %
±1%
RESISTANCE VALUE
ACAC 0612, ACAS 0612
47
Ω
to 221 kΩ
47
Ω
to 221 kΩ
47
Ω
to 221 kΩ
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For technical questions, contact: filmresistors.thinfilmarray@vishay.com
Document Number: 28754
Revision: 11-Sep-08
ACAC 0612, ACAS 0612 - Professional
Professional Thin Film Chip Resistor Array
Vishay Beyschlag
APPLICATION INFORMATION
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using reflow or vapour phase as shown in
IEC 61760-1*.
For ACAC resistor arrays automatic soldering
using wave can also be used. The encapsulation is resistant
to all cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, if applied, shall be
qualified by appropriate means to ensure the long-term
stability of the whole system. The resistors are RoHS
compliant; the pure tin plating provides compatibility with
lead (Pb)-free and lead-containing soldering processes. The
permitted storage time is 20 years, whereas the solderability
is specified for 2 years after production or requalification. The
immunity of the plating against tin whisker growth has been
proven under extensive testing.
All products comply with the
GADSL
(1)
and the
CEFIC-EECA-EICTA
(2)
list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
•
2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
•
2002/95/EC Restriction of
Substances directive (RoHS)
the
use
of
Hazardous
R
1
R
2
R
3
R
4
Circuit Type 03
DESCRIPTION
The production of the components is strictly controlled and
follows an extensive set of instructions established for
reproducibility. A homogeneous film of metal alloy is
deposited on a high grade (96 % Al
2
O
3
) ceramic substrate
and conditioned to achieve the desired temperature
coefficient. Specially designed inner contacts are realised on
both sides. A special laser is used to achieve the target value
by smoothly cutting a meander groove in the resistive layer
without damaging the ceramics.
The resistor elements are covered by a protective coating
designed for electrical, mechanical and climatic protection.
The terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with
IEC 60286-3*.
•
2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
APPROVALS
Where applicable, the resistors are tested in accordance with
EN 140401-801
which refers to
EN 60115-1
and
EN 140400.
Notes
(1)
Global Automotive Declarable Substance List, see www.gadsl.org
(2)
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org
→
issues
→
environment policy
→
chemicals
→
chemicals for electronics
• The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents
Document Number: 28754
Revision: 11-Sep-08
For technical questions, contact: filmresistors.thinfilmarray@vishay.com
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271
ACAC 0612, ACAS 0612 - Professional
Vishay Beyschlag
Professional Thin Film Chip Resistor Array
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
EN 60115-1,
Generic specification (includes tests)
EN 140400,
Sectional specification (includes schedule for
qualification approval)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with
IEC 60068*
and under standard atmospheric conditions according to
IEC 60068-1*,
5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
In the following table only the tests and requirements are
listed with reference to the relevant clauses of
EN 60115-1
and
IEC 60068-2*;
a short description of the test procedure
is also given.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2*
TEST
METHOD
TEST
PROCEDURE
Stability for product types:
ACAC 0612, ACAS 0612
Climatic category
(LCT/UCT/duration)
-
At 20/LCT/ 20
°C
and
20/UCT/20
°C
U
=
P
70
x
R
or
U
=
U
max.
;
1.5 h on; 0.5 h off;
70
°C;
1000 h
125
°C;
1000 h
(40 ± 2)
°C;
56 days;
(93 ± 3) % RH
U
= 2.5 x
P
70
x
R
or
U
= 2 x
U
max.
; 5 s
30 min at LCT and
30 min at UCT;
5 cycles
Reflow method 2
(IR/forced gas convention);
(260 ± 5)
°C;
(10 ± 1) s
Solder bath method;
SnPb; non-activated flux
accelerated ageing 4 h/155 °C
(215 ± 3)
°C;
(3 ± 0.3) s
Solder bath method;
SnAgCu; non-activated flux
accelerated ageing 4 h/155 °C
(235 ± 3)
°C;
(2 ± 0.2) s
45 N
Depth 2 mm, 3 times
U
rms
=
U
ins
60 ± 5 s; against ambient,
between adjacent resistors
47
Ω
to 221 kΩ
- 55 °C/+ 125 °C/56 days
± 1 %; ± 0.5 %; ± 0.25 %
± 50 ppm/K; ± 25 ppm/K
± (0.25 %
R
+ 0.05
Ω)
± (0.25 %
R
+ 0.05
Ω)
± (0.5 %
R
+ 0.05
Ω)
± (0.1 %
R
+ 0.01
Ω)
no visible damage
± (0.1 %
R
+ 0.01
Ω)
no visible damage
± (0.25 %
R
+ 0.01
Ω)
no visible damage
REQUIREMENTS
(1)
PERMISSIBLE CHANGE (ΔR)
4.5
4.8.4.2
4.25.1
4.25.3
4.24
4.13
4.19
-
-
-
-
78 (Cab)
-
14 (Na)
Resistance
Temperature coefficient
Endurance
Endurance at upper
category temperature
Damp heat,
steady state
Short time overload
(2)
Rapid change of
temperature
Resistance to soldering
heat
4.18.2
58 (Td)
4.17.2
58 (Td)
Solderability
Good tinning (≥ 95 % covered);
no visible damage
4.32
4.33
21 (Ue
3
)
21 (Ue
1
)
Shear (adhesion)
Substrate bending
No visible damage
± (0.1 %
R
+ 0.01
Ω)
no visible damage;
no open circuit in bent position
No flashover or breakdown
4.7
-
Voltage proof
Notes
(1)
Figures are given for equal values
(2)
For a single element
• The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents
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Document Number: 28754
Revision: 11-Sep-08
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