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M390S6553BT1-C7A

Description
Synchronous DRAM Module, 64MX72, 5.4ns, CMOS, DIMM-168
Categorystorage    storage   
File Size659KB,26 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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M390S6553BT1-C7A Overview

Synchronous DRAM Module, 64MX72, 5.4ns, CMOS, DIMM-168

M390S6553BT1-C7A Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeDIMM
package instructionDIMM, DIMM168
Contacts168
Reach Compliance Codecompli
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density4831838208 bi
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width72
Humidity sensitivity level1
Number of functions1
Number of ports1
Number of terminals168
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64MX72
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
self refreshYES
Maximum standby current0.02 A
Maximum slew rate2.3 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
512MB, 1GB, 2GB Registered DIMM
SDRAM
SDRAM Registered Module
168pin Registered Module based on 512Mb B-die
with 72-bit ECC
Revision 1.0
January 2004
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 1.0 January 2004

M390S6553BT1-C7A Related Products

M390S6553BT1-C7A M390S2953BT1-C7A 206323LPSTN M390S2950BTU-C7A M390S5658BT1-C7A M390S2950BT1-C7A
Description Synchronous DRAM Module, 64MX72, 5.4ns, CMOS, DIMM-168 Synchronous DRAM Module, 128MX72, 5.4ns, CMOS, DIMM-168 Right Angle Panel DIP Switch Synchronous DRAM Module, 128MX72, 5.4ns, CMOS, DIMM-168 Synchronous DRAM Module, 256MX72, 5.4ns, CMOS, DIMM-168 Synchronous DRAM Module, 128MX72, 5.4ns, CMOS, DIMM-168
Is it Rohs certified? incompatible incompatible - incompatible incompatible incompatible
Maker SAMSUNG SAMSUNG - SAMSUNG SAMSUNG SAMSUNG
Parts packaging code DIMM DIMM - DIMM DIMM DIMM
package instruction DIMM, DIMM168 DIMM, DIMM168 - DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168
Contacts 168 168 - 168 168 168
Reach Compliance Code compli compliant - compliant unknown unknown
ECCN code EAR99 EAR99 - EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST - FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 5.4 ns 5.4 ns - 5.4 ns 5.4 ns 5.4 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 133 MHz 133 MHz - 133 MHz 133 MHz 133 MHz
I/O type COMMON COMMON - COMMON COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168 - R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 4831838208 bi 9663676416 bit - 9663676416 bit 19327352832 bit 9663676416 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE - SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 72 72 - 72 72 72
Humidity sensitivity level 1 1 - 1 1 1
Number of functions 1 1 - 1 1 1
Number of ports 1 1 - 1 1 1
Number of terminals 168 168 - 168 168 168
word count 67108864 words 134217728 words - 134217728 words 268435456 words 134217728 words
character code 64000000 128000000 - 128000000 256000000 128000000
Operating mode SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C - 70 °C 70 °C 70 °C
organize 64MX72 128MX72 - 128MX72 256MX72 128MX72
Output characteristics 3-STATE 3-STATE - 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM - DIMM DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168 - DIMM168 DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) 225 225 - 225 225 225
power supply 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
refresh cycle 8192 8192 - 8192 8192 8192
self refresh YES YES - YES YES YES
Maximum standby current 0.02 A 0.04 A - 0.04 A 0.075 A 0.04 A
Maximum slew rate 2.3 mA 2.345 mA - 4.1 mA 4.64 mA 4.1 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V - 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V
surface mount NO NO - NO NO NO
technology CMOS CMOS - CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD - NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm - 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL - DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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