ISL55110IVZ-T datasheet, PDF - EEWORLD Datasheet

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ISL55110IVZ-T: DescriptionDual, High Speed MOSFET Driver; QFN16, TSSOP8; Temp Range: -40° to 85°C; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size890KB，18 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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ISL55110IVZ-T Overview

Dual, High Speed MOSFET Driver; QFN16, TSSOP8; Temp Range: -40° to 85°C

ISL55110IVZ-T Parametric

Parameter Name	Attribute value
Brand Name	Intersil
Maker	Renesas Electronics Corporation
Parts packaging code	QFN, TSSOP
package instruction	TSSOP, TSSOP8,.25
Contacts	16, 8
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	8 weeks
high side driver	NO
Interface integrated circuit type	HALF BRIDGE BASED MOSFET DRIVER
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	4.4 mm
Humidity sensitivity level	1
Number of functions	2
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Nominal output peak current	3.5 A
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage	13.2 V
Minimum supply voltage	5 V
Nominal supply voltage	12 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3 mm

ISL55110IVZ-T Related Products

	ISL55110IVZ-T	ISL55110IRZ	ISL55110IRZ-T	ISL55111IRZ	ISL55111IVZ
Description	Dual, High Speed MOSFET Driver; QFN16, TSSOP8; Temp Range: -40° to 85°C	Dual, High Speed MOSFET Driver; QFN16, TSSOP8; Temp Range: -40° to 85°C	Dual, High Speed MOSFET Driver; QFN16, TSSOP8; Temp Range: -40° to 85°C	Dual, High Speed MOSFET Driver	Dual, High Speed MOSFET Driver
Brand Name	Intersil	Intersil	Intersil	Renesas	Renesas
Parts packaging code	QFN, TSSOP	QFN, TSSOP	QFN, TSSOP	QFN	TSSOP
package instruction	TSSOP, TSSOP8,.25	HVQCCN, LCC16,.16SQ,25	HVQCCN, LCC16,.16SQ,25	HVQCCN,	TSSOP,
Contacts	16, 8	16, 8	16, 8	16	8
Reach Compliance Code	compli	compliant	compli	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
high side driver	NO	NO	NO	NO	NO
Interface integrated circuit type	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER
JESD-30 code	R-PDSO-G8	S-PQCC-N16	S-PQCC-N16	S-PQCC-N16	R-PDSO-G8
JESD-609 code	e3	e3	e3	e3	e3
length	4.4 mm	4 mm	4 mm	4 mm	4.4 mm
Humidity sensitivity level	1	1	1	1	1
Number of functions	2	2	2	2	2
Number of terminals	8	16	16	16	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Nominal output peak current	3.5 A	3.5 A	3.5 A	3.5 A	3.5 A
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	HVQCCN	HVQCCN	HVQCCN	TSSOP
Package shape	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Maximum seat height	1.2 mm	1 mm	1 mm	1 mm	1.2 mm
Maximum supply voltage	13.2 V	13.2 V	13.2 V	5.5 V	5.5 V
Minimum supply voltage	5 V	5 V	5 V	2.7 V	2.7 V
Nominal supply voltage	12 V	12 V	12 V	3.6 V	3.6 V
surface mount	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	GULL WING	NO LEAD	NO LEAD	NO LEAD	GULL WING
Terminal pitch	0.65 mm	0.5 mm	0.5 mm	0.5 mm	0.65 mm
Terminal location	DUAL	QUAD	QUAD	QUAD	DUAL
width	3 mm	4 mm	4 mm	4 mm	3 mm
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	-	-
Factory Lead Time	8 weeks	6 weeks	6 weeks	-	-
Encapsulate equivalent code	TSSOP8,.25	LCC16,.16SQ,25	LCC16,.16SQ,25	-	-
Peak Reflow Temperature (Celsius)	260	260	260	-	NOT SPECIFIED
power supply	3/5 V	3/5 V	3/5 V	-	-
Certification status	Not Qualified	Not Qualified	Not Qualified	-	-
technology	CMOS	CMOS	CMOS	-	-
Maximum time at peak reflow temperature	30	30	30	-	NOT SPECIFIED

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