IS43LD32160A-3BLI datasheet, PDF

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IS43LD32160A-3BLI: DescriptionDDR DRAM, 16MX32, CMOS, PBGA134, TFBGA-134; Categorystorage storage; File Size6MB，143 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS43LD32160A-3BLI Overview

DDR DRAM, 16MX32, CMOS, PBGA134, TFBGA-134

IS43LD32160A-3BLI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
package instruction	TFBGA,
Reach Compliance Code	compli
access mode	FOUR BANK PAGE BURST
Other features	SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY
JESD-30 code	R-PBGA-B134
JESD-609 code	e1
length	11.5 mm
memory density	536870912 bi
Memory IC Type	DDR DRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	134
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX32
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	1.1 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.3 V
Minimum supply voltage (Vsup)	1.14 V
Nominal supply voltage (Vsup)	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm

IS43LD32160A-3BLI Related Products

	IS43LD32160A-3BLI	IS46LD32160A-3BLA2	IS46LD32160A-3BLA1	IS43LD32160A-3BL	IS46LD32160A-25BLA1	IS46LD32160A-25BLA2
Description	DDR DRAM, 16MX32, CMOS, PBGA134, TFBGA-134	DDR DRAM, 16MX32, CMOS, PBGA134, TFBGA-134	DDR DRAM, 16MX32, CMOS, PBGA134, TFBGA-134	DDR DRAM, 16MX32, CMOS, PBGA134, TFBGA-134	DDR DRAM, 16MX32, CMOS, PBGA134, TFBGA-134	DDR DRAM, 16MX32, CMOS, PBGA134, TFBGA-134
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,
Reach Compliance Code	compli	compliant	compliant	compli	compli	compli
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Other features	SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY	SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY	SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY	SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY	SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY	SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY
JESD-30 code	R-PBGA-B134	R-PBGA-B134	R-PBGA-B134	R-PBGA-B134	R-PBGA-B134	R-PBGA-B134
JESD-609 code	e1	e1	e1	e1	e1	e1
length	11.5 mm	11.5 mm	11.5 mm	11.5 mm	11.5 mm	11.5 mm
memory density	536870912 bi	536870912 bit	536870912 bit	536870912 bi	536870912 bi	536870912 bi
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	134	134	134	134	134	134
word count	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	105 °C	85 °C	85 °C	85 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C
organize	16MX32	16MX32	16MX32	16MX32	16MX32	16MX32
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	260	260	260	260
Maximum seat height	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm	1.1 mm
self refresh	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V	1.3 V
Minimum supply voltage (Vsup)	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V
Nominal supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	OTHER	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	10	10	10	10
width	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
Maker	Integrated Silicon Solution ( ISSI )	-	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )

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