W25P10, W25P20 AND W25P40
1M-BIT, 2M-BIT AND 4M-BIT
SERIAL FLASH MEMORY WITH 40MHZ SPI
Formally NexFlash NX25P10, NX25P20 and NX25P40
The Winbond W25P10/20/40 are fully compatible with the previous NexFlash
NX25P10/20/40 Serial Flash memories.
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Publication Release Date: November 28, 2005
Revision M
W25P10, W25P20 AND W25P40
Table of Contents-
1.
2.
3.
4.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATION ............................................................................................................... 5
PIN DESCRIPTION..................................................................................................................... 5
4.1
4.2
4.3
4.4
4.5
4.6
4.7
5.
6.
Package Types ............................................................................................................... 5
Chip Select (/CS) ............................................................................................................ 5
Serial Data Output (DO) ................................................................................................. 6
Write Protect (/WP)......................................................................................................... 6
HOLD (/HOLD) ............................................................................................................... 6
Serial Clock (CLK) .......................................................................................................... 6
Serial Data Input (DI) ...................................................................................................... 6
BLOCK DIAGRAM ...................................................................................................................... 7
FUNCTIONAL DESCRIPTION ................................................................................................... 8
6.1
SPI OPERATIONS ......................................................................................................... 8
6.1.1
6.1.2
SPI Modes ........................................................................................................................8
Hold Function ...................................................................................................................8
Write Protect Features......................................................................................................8
6.2
7.
WRITE PROTECTION.................................................................................................... 8
6.2.1
CONTROL AND STATUS REGISTERS..................................................................................... 9
7.1
STATUS REGISTER ...................................................................................................... 9
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
BUSY................................................................................................................................9
Write Enable Latch (WEL) ................................................................................................9
Block Protect Bits (BP2, BP1, BP0)................................................................................10
Reserved Bits .................................................................................................................10
Status Register Protect (SRP) ........................................................................................10
Status Register Memory Protection ................................................................................11
Manufacturer and Device Identification...........................................................................12
Instruction Set
(1)
.............................................................................................................12
Write Disable (04h).........................................................................................................13
Write Enable (06h)..........................................................................................................13
Read Status Register (05h) ............................................................................................14
Write Status Register (01h) ............................................................................................15
Read Data (03h) .............................................................................................................16
Fast Read (0Bh) .............................................................................................................17
Page Program (02h) .......................................................................................................18
Sector Erase (D8h).......................................................................................................19
7.2
INSTRUCTIONS........................................................................................................... 11
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
7.2.8
7.2.9
7.2.10
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W25P10, W25P20 AND W25P40
7.2.11
7.2.12
7.2.13
7.2.14
Chip Erase (C7h)..........................................................................................................20
Power-down (B9h) ........................................................................................................21
Release Power-down / Device ID (ABh) .......................................................................22
Read Manufacturer / Device ID (90h) ...........................................................................24
8.
ELECTRICAL CHARACTERISTICS......................................................................................... 25
8.1
Absolute Maximum Ratings (1) .................................................................................... 25
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
Operating Ranges......................................................................................................... 25
Power-up Timing and Write Inhibit Threshold .............................................................. 26
DC Electrical Characteristics (Preliminary)(1) .............................................................. 27
AC Measurement Conditions........................................................................................ 28
AC Electrical Characteristics ........................................................................................ 29
AC Electrical Characteristics (cont’d) ........................................................................... 30
Serial Output Timing ..................................................................................................... 31
Input Timing .................................................................................................................. 31
Hold Timing................................................................................................................... 31
8-Pin SOIC 150-mil (Winbond Package Code SN) (NexFlash Package Code N) ....... 32
9.
10.
11.
PACKAGE SPECIFICATION .................................................................................................... 32
9.1
ORDERING INFORMATION .................................................................................................... 33
REVISION HISTORY ................................................................................................................ 34
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Publication Release Date: November 28, 2005
Revision M
W25P10, W25P20 AND W25P40
1. GENERAL DESCRIPTION
The W25P10 (1M-bit), W25P20 (2M-bit) and W25P40 (4M-bit) Serial Flash memories provide a
storage solution for systems with limited space, pins and power. They are ideal for code download
applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V
power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are
offered in space-saving 8-pin SOIC type packages as shown below. Contact Winbond for availability
of alternate packages. As part of a family of Serial Flash products, Winbond also provides a
compatible migration path to 8M/16M/32M-bit densities.
The W25P10/20/40 array is organized into 512/1024/2048 programmable pages of 256-bytes each. A
single byte or, up to 256 bytes, can be programmed at a time using the Page Program instruction.
Pages are grouped into 2/4/8 erasable sectors of 256 pages (64K-byte) each as shown in figure 2.
Both Sector Erase and Chip (full chip) Erase instructions are supported.
The Serial Peripheral Interface (SPI) consists of four pins (Serial Clock, Chip Select, Serial Data In
and Serial Data Out) that support high speed serial data transfers up to 40MHz. A Hold pin, Write
Protect pin and programmable write protect features provide further control flexibility. Additionally, the
device can be queried for manufacturer and device ID. Special customer ID (for copy authentication)
and factory programming is available, contact Winbond for more information.
The Winbond W25P10/20/40 are fully compatible with the previous NexFlash NX25P10/20/40 Serial
Flash memories.
2. FEATURES
•
1M / 2M / 4M-bit Serial Flash Memories
•
Family of Serial Flash Memories
– W25P10: 1M-bit/128K-byte (131,072)
– W25P20: 2M-bit/256K-byte (262,144)
– W25P40: 4M-bit/512K-byte (524,288)
– 256-bytes per programmable page
– Migration path to 8M/16M/32M-bit
•
4-pin SPI Serial Interface
– Clock, Chip Select, Data In, Data Out
– Easily interfaces to popular microcontrollers
– Compatible with SPI Modes 0 and 3
– Bottom Boot organization (standard)
– Optional Hold function for SPI flexibility
•
Low Power Consumption, Wide
Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, 1µA Power-down (typ)
– -40° to +85°C operating range
•
Fast and Flexible Serial Data Access
– 40MHz Fast Read, 33MHz Standard Read
– Byte-addressable Read and Program
– Auto-increment Read capability
– Manufacturer and Device ID
•
Programming Features
– Page program up to 256 bytes <2ms
– Sector Erase (64K-byte) 2 seconds
– Chip erase: 3 seconds (25P10/20),
5 seconds (25P40)
– 100,000 erase/write cycles
– Twenty-year data retention
•
Software and Hardware Write Protection
– Write-Protect all or portion of memory
– Enable/Disable protection with /WP pin
•
Space Saving Package
– Tiny 8-pin SOIC 150mil
•
Ideal for systems with limited pins, space,
and power
– Controller-based serial code-download
– µC systems storing data, text or voice
– Battery-operated and portable products
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W25P10, W25P20 AND W25P40
3. PIN CONFIGURATION
Figure 1. W25P10, W25P20 and W25P40 Pin Assignments, 8-pin SOIC 150-mil
4. PIN DESCRIPTION
PIN NO.
PIN NAME
I/O
FUNCTION
1
2
3
4
5
6
7
8
/CS
DO
/WP
GND
DI
CLK
/HOLD
VCC
I
O
I
I
I
I
Chip Select Input
Data Output
Write Protect Input
Ground
Data Input
Serial Clock Input
Hold Input
Power Supply
4.1
Package Types
The standard package for the W25P10/20/40 is an 8-pin plastic SOIC with 150-mil body (Winbond
package code SN) (NexFlash package code N). It also allows a package migration path to higher
density Serial Flash devices. The pinout for the package is shown in Figure 1. Package diagrams and
dimensions are illustrated at the end of this data sheet. Optional 8-contact MLP packages may be
available. Please contact Winbond for further MLP package information.
4.2
Chip Select (/CS)
The SPI Chip Select (/CS pin enables and disables device operation. When /CS is high the device is
deselected and the Serial Data Output (DO) pin is at high impedance. When deselected, the devices
power consumption will be at standby levels unless an internal erase, program or status register cycle
is in progress. When /CS is brought low the device will be selected, power consumption will increase
to active levels and instructions can be written to and data read from the device. After power-up, /CS
must transition from high to low before a new instruction will be accepted. The /CS input must track
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Publication Release Date: November 28, 2005
Revision M
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