V73CBG02168RBJG6I datasheet, PDF

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V73CBG02168RBJG6I: DescriptionDDR DRAM, 128MX16, 0.4ns, CMOS, PBGA96,; Categorystorage storage; File Size2MB，57 Pages; ManufacturerProMOS Technologies Inc; Environmental Compliance

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V73CBG02168RBJG6I Overview

DDR DRAM, 128MX16, 0.4ns, CMOS, PBGA96,

V73CBG02168RBJG6I Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	ProMOS Technologies Inc
Reach Compliance Code	compli
Maximum access time	0.4 ns
Maximum clock frequency (fCLK)	400 MHz
I/O type	COMMON
interleaved burst length	8
JESD-30 code	R-PBGA-B96
memory density	2147483648 bi
Memory IC Type	DDR DRAM
memory width	16
Number of terminals	96
word count	134217728 words
character code	128000000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA96,9X16,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
power supply	1.35 V
Certification status	Not Qualified
refresh cycle	8192
Continuous burst length	8
Maximum standby current	0.011 A
Maximum slew rate	0.18 mA
Nominal supply voltage (Vsup)	1.35 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM

V73CBG02168RBJG6I Related Products

	V73CBG02168RBJG6I	V73CBG02168RBJH7	V73CBG02168RBLJG6
Description	DDR DRAM, 128MX16, 0.4ns, CMOS, PBGA96,	DDR DRAM, 128MX16, 0.3ns, CMOS, PBGA96,	DDR DRAM, 128MX16, 0.4ns, CMOS, PBGA96,
Is it Rohs certified?	conform to	conform to	conform to
Maker	ProMOS Technologies Inc	ProMOS Technologies Inc	ProMOS Technologies Inc
Reach Compliance Code	compli	compliant	compli
Maximum access time	0.4 ns	0.3 ns	0.4 ns
Maximum clock frequency (fCLK)	400 MHz	533 MHz	400 MHz
I/O type	COMMON	COMMON	COMMON
interleaved burst length	8	8	8
JESD-30 code	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96
memory density	2147483648 bi	2147483648 bit	2147483648 bi
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM
memory width	16	16	16
Number of terminals	96	96	96
word count	134217728 words	134217728 words	134217728 words
character code	128000000	128000000	128000000
Maximum operating temperature	85 °C	85 °C	85 °C
organize	128MX16	128MX16	128MX16
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA	FBGA
Encapsulate equivalent code	BGA96,9X16,32	BGA96,9X16,32	BGA96,9X16,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
power supply	1.35 V	1.35 V	1.35 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192
Continuous burst length	8	8	8
Maximum standby current	0.011 A	0.011 A	0.011 A
Maximum slew rate	0.18 mA	0.19 mA	0.18 mA
Nominal supply voltage (Vsup)	1.35 V	1.35 V	1.35 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	OTHER
Terminal form	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM

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