Standard SRAM, 512KX8, 20ns, CMOS, PBGA48, 10 X 8 X 1.4 MM, CHIP SIZE, BGA-48
Parameter Name | Attribute value |
Maker | APTA Group Inc |
Parts packaging code | BGA |
package instruction | LBGA, |
Contacts | 48 |
Reach Compliance Code | unknow |
ECCN code | 3A991.B.2.A |
Maximum access time | 20 ns |
JESD-30 code | R-PBGA-B48 |
memory density | 4194304 bi |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 1.4 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
MSM8V512CBI-020/48D | MSM8V512CBI-015/48D | MSM8V512CB-015/48D | MSM8V512CB-020/48D | |
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Description | Standard SRAM, 512KX8, 20ns, CMOS, PBGA48, 10 X 8 X 1.4 MM, CHIP SIZE, BGA-48 | Standard SRAM, 512KX8, 15ns, CMOS, PBGA48, 10 X 8 X 1.4 MM, CHIP SIZE, BGA-48 | Standard SRAM, 512KX8, 15ns, CMOS, PBGA48, 10 X 8 X 1.4 MM, CHIP SIZE, BGA-48 | Standard SRAM, 512KX8, 20ns, CMOS, PBGA48, 10 X 8 X 1.4 MM, CHIP SIZE, BGA-48 |
Maker | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc |
Parts packaging code | BGA | BGA | BGA | BGA |
package instruction | LBGA, | LBGA, | LBGA, | LBGA, |
Contacts | 48 | 48 | 48 | 48 |
Reach Compliance Code | unknow | unknow | unknow | unknow |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 20 ns | 15 ns | 15 ns | 20 ns |
JESD-30 code | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
memory density | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 48 | 48 | 48 | 48 |
word count | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C |
organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LBGA | LBGA | LBGA | LBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
Terminal form | BALL | BALL | BALL | BALL |
Terminal pitch | 1 mm | 1 mm | 1 mm | 1 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |