SRAM Module, 1MX9, 35ns, CMOS
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | APTA Group Inc |
package instruction | , SIP44,.2 |
Reach Compliance Code | unknow |
Maximum access time | 35 ns |
I/O type | SEPARATE |
JESD-609 code | e0 |
memory density | 9437184 bi |
Memory IC Type | SRAM MODULE |
memory width | 9 |
Number of terminals | 44 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1MX9 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
Encapsulate equivalent code | SIP44,.2 |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.0225 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 1.125 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal pitch | 2.54 mm |
Terminal location | SINGLE |
MS91000RKXI-35 | MS91000RKX-30 | MS91000RKXLI-30 | |
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Description | SRAM Module, 1MX9, 35ns, CMOS | SRAM Module, 1MX9, 30ns, CMOS | SRAM Module, 1MX9, 30ns, CMOS |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | APTA Group Inc | APTA Group Inc | APTA Group Inc |
package instruction | , SIP44,.2 | , SIP44,.2 | , SIP44,.2 |
Reach Compliance Code | unknow | unknown | unknow |
Maximum access time | 35 ns | 30 ns | 30 ns |
I/O type | SEPARATE | SEPARATE | SEPARATE |
JESD-609 code | e0 | e0 | e0 |
memory density | 9437184 bi | 9437184 bit | 9437184 bi |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 9 | 9 | 9 |
Number of terminals | 44 | 44 | 44 |
word count | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 85 °C |
Minimum operating temperature | -40 °C | - | -40 °C |
organize | 1MX9 | 1MX9 | 1MX9 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Encapsulate equivalent code | SIP44,.2 | SIP44,.2 | SIP44,.2 |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.0225 A | 0.0225 A | 0.001 A |
Minimum standby current | 4.5 V | 4.5 V | 2 V |
Maximum slew rate | 1.125 mA | 1.125 mA | 1.125 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | SINGLE | SINGLE | SINGLE |