Buffer, AUP/ULP/V Series, 2-Func, 1-Input, CMOS, PDSO6
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Nexperia |
package instruction | VSON, |
Reach Compliance Code | compli |
series | AUP/ULP/V |
JESD-30 code | S-PDSO-N6 |
JESD-609 code | e3 |
length | 1 mm |
Logic integrated circuit type | BUFFER |
Humidity sensitivity level | 1 |
Number of functions | 2 |
Number of entries | 1 |
Number of terminals | 6 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Output characteristics | OPEN-DRAIN |
Package body material | PLASTIC/EPOXY |
encapsulated code | VSON |
Package shape | SQUARE |
Package form | SMALL OUTLINE, VERY THIN PROFILE |
propagation delay (tpd) | 20.7 ns |
Maximum seat height | 0.5 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 0.8 V |
Nominal supply voltage (Vsup) | 1.1 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | Tin (Sn) |
Terminal form | NO LEAD |
Terminal pitch | 0.35 mm |
Terminal location | DUAL |
width | 1 mm |
935281294132 | 935291761132 | 935281294115 | |
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Description | Buffer, AUP/ULP/V Series, 2-Func, 1-Input, CMOS, PDSO6 | Buffer, AUP/ULP/V Series, 2-Func, 1-Input, CMOS, PDSO6 | Buffer, AUP/ULP/V Series, 2-Func, 1-Input, CMOS, PDSO6 |
Is it Rohs certified? | conform to | conform to | conform to |
package instruction | VSON, | SON, | VSON, |
Reach Compliance Code | compli | compliant | compli |
series | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
JESD-30 code | S-PDSO-N6 | R-PDSO-N6 | S-PDSO-N6 |
JESD-609 code | e3 | e3 | e3 |
length | 1 mm | 1 mm | 1 mm |
Logic integrated circuit type | BUFFER | BUFFER | BUFFER |
Humidity sensitivity level | 1 | 1 | 1 |
Number of functions | 2 | 2 | 2 |
Number of entries | 1 | 1 | 1 |
Number of terminals | 6 | 6 | 6 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | VSON | SON | VSON |
Package shape | SQUARE | RECTANGULAR | SQUARE |
Package form | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE |
propagation delay (tpd) | 20.7 ns | 20.7 ns | 20.7 ns |
Maximum seat height | 0.5 mm | 0.35 mm | 0.5 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 0.8 V | 0.8 V | 0.8 V |
Nominal supply voltage (Vsup) | 1.1 V | 1.1 V | 1.1 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
Terminal surface | Tin (Sn) | Tin (Sn) | Tin (Sn) |
Terminal form | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 0.35 mm | 0.3 mm | 0.35 mm |
Terminal location | DUAL | DUAL | DUAL |
width | 1 mm | 0.9 mm | 1 mm |
Maker | Nexperia | - | Nexperia |