S72NS256RD0KHFM03 datasheet, PDF

S72NS256RD0KHFM03: DescriptionMemory Circuit, Flash+SDRAM, 16MX16, CMOS, PBGA128, 12 X 12 MM, FBGA-128; Categorystorage storage; File Size619KB，13 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S72NS256RD0KHFM03 Overview

Memory Circuit, Flash+SDRAM, 16MX16, CMOS, PBGA128, 12 X 12 MM, FBGA-128

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	TFBGA, BGA128,18X18,25
Contacts	128
Reach Compliance Code	unknow
Other features	DRAM IS ORGANISED AS 8M X 16
JESD-30 code	S-PBGA-B128
length	12 mm
memory density	268435456 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+SDRAM
Number of functions	1
Number of terminals	128
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA128,18X18,25
Package shape	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
power supply	1.8 V
Certification status	Not Qualified
Maximum seat height	1.05 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
width	12 mm

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