Ordering Information .................................................................................................................................................................... 2
7.1. User Programming Interface ..................................................................................................................................... 19
7.2. Start-up output frequency and signaling types .......................................................................................................... 19
8.1. Any-frequency function ............................................................................................................................................. 20
9 I C/SPI Control Registers...................................................................................................................................................... 29
9.1. Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 29
9.2. Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 30
9.3. Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 31
9.4. Register Address: 0x03. Flac-N PLL Integer Value and Flac-N PLL Fraction MSW ................................................. 32
9.6. Register Address: 0x05. PostDiv, Driver Control ...................................................................................................... 33
9.7. Register Address: 0x06. mDriver, Driver Control ...................................................................................................... 34
2
10 I C Operation ........................................................................................................................................................................ 35
2
10.1. I C protocol ............................................................................................................................................................... 35
2
10.2. I C Timing Specification ............................................................................................................................................ 37
2
10.3. I C Device Address Modes ....................................................................................................................................... 38
Dimensions and Patterns ........................................................................................................................................................... 45
Additional Information ................................................................................................................................................................ 46
Revision History ......................................................................................................................................................................... 47
Rev 0.991
Page 3 of 47
www.sitime.com
SiT3521
1 to 340 MHz Elite™ I
2
C/SPI Programmable Oscillator
1 Electrical Characteristics
PRELIMINARY
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Frequency Stability
Symbol
f
F_stab
Min.
1
-10
-20
-25
-50
First Year Aging
Operating Temperature Range
F_1y
T_use
–
-20
-40
-40
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
Duty Cycle
Start-up Time
Output Enable/Disable Time –
Hardware control via OE pin
Output Enable/Disable Time –
Software control via I
2
C/SPI
VIH
VIL
Z_in
DC
T_start
T_oe_hw
70%
–
–
45
–
–
Typ.
–
–
–
–
–
±1
–
–
–
3.3
3.0
2.8
2.5
–
–
100
–
–
–
Max.
340
+10
+20
+25
+50
–
+70
+85
+105
Supply Voltage
3.63
3.3
3.08
2.75
–
30%
–
55
3.0
3.8
V
V
V
V
Vdd
Vdd
kΩ
%
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 30
and
Figure 31
OE pin
OE pin
OE pin, logic high or logic low
Unit
MHz
ppm
ppm
ppm
ppm
ppm
°C
°C
°C
1 -year aging at 25°C
Extended Commercial
Industrial
Extended Industrial. Available only for I C operation, not SPI.
2
st
Condition
Factory or user programmable, accurate to 6 decimal places
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations.
Frequency Range
Frequency Stability
Temperature Range
Input Characteristics – OE Pin
Output Characteristics
Startup and Output Enable/Disable Timing
T_oe_sw
–
–
6.5
µs
Rev 0.991
Page 4 of 47
www.sitime.com
SiT3521
1 to 340 MHz Elite™ I
2
C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
PRELIMINARY
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.15
–
89
58
–
32
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B.
T_jitt
–
0.225
0.1
0.225
0.11
1
0.340
0.14
0.340
0.15
1.6
ps
ps
ps
ps
ps
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 100, 156.25 or 212.5 MHz, Vdd = 3.3V or 2.5V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
80
61
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
Delta VOD
Offset Voltage
Delta VOS
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
400
455
50
1.375
50
470
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B.
T_jitt
–
0.21
0.1
0.21
0.1
1
0.275
0.12
0.367
0.12
1.6
ps
ps
ps
ps
ps
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 156.25, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 100, 156.25 or 212.5 MHz, Vdd = 3.3V or 2.5V
mV
mV
V
mV
ps
f = 156.25MHz See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
SOP packaging is a form of component packaging. Common packaging materials include plastic, ceramic, glass, metal, etc. Plastic packaging is now basically used. It has a wide range of applications and...
The power supply and disconnection of 12V door locks (such as magnetic locks, cathode locks, etc.) are controlled by relays. The back electromotive force generated by the door locks every time they sw...
The external FLASH of STM32F746GDiscovery is broken. I want to replace it with a new one, but I can't blow it off with an air gun. I tried twice, but I couldn't blow it off. The first time I tried, I ...
[b]Aerial photography drones can only be multi-rotor drones? Parrot stands up and gives you a fixed-wing Parrot Disco... [/b] [color=#444444][backcolor=rgb(255, 255, 255)][font=Verdana, Arial, sans-se...
The previous article introduced the use of LCD screen. This screen also has a touch function. This article will introduce the use of the touch function of LCD.
There is a lot of content about touch, w...
1 SLS molding principle and characteristics SLS (Selective Laser Sintering) molding principle : Using JY-ⅢA type continuous CO2 laser as the energy source, at the beginning of molding, the powder rol...[Details]
According to foreign media 9to5Mac, people familiar with the matter revealed that Apple is internally testing a new display equipped with an A13 chip. The display is codenamed J327, but details abo...[Details]
IP developer M31 Technology announced that it will develop SRAM Compiler IP on TSMC’s 28nm Embedded Flash Process. This series of IP is expected to be available for customer design integration in the...[Details]
1. Introduction: Huawei's second folding experience from Mate X2's new thinking on folding phones People's demands for terminal devices are often contradictory. Large battery, large screen, ...[Details]
1. Introduction Near-infrared spectroscopy is a powerful technology that enables the identification and classification of physical materials through changes in a sample's absorption or emission of li...[Details]
The sudden outbreak of the COVID-19 pandemic has led to the deployment of a large number of inspection robots. In addition to infrared inspection robots that can be seen everywhere in important publi...[Details]
According to foreign media reports, Chinese and British researchers have developed a new rechargeable battery with salt as its main ingredient, which can accelerate the industry's transition to green...[Details]
Let me say a few words to explain some concepts to those who are confused about operating systems (especially embedded operating systems) like I was before. Because people always ask whether they mus...[Details]
1. Accurately measure diodes When measuring the diode accurately, the red DC ammeter is plugged into the "VΩ" socket and the black DC ammeter is plugged into the "COM" socket. Select the "Diode Accur...[Details]
ARM embedded systems often encounter the need for multiple serial ports, but the number of native UARTs in ARM chip systems is limited, so it is necessary to expand more interfaces through other high-...[Details]
/**************************************************************************************** Simple menu program, eight buttons. Using AVR microcontroller. 2008/3/24--2008/3/29 The compiler is ICCAVR7....[Details]
51 microcontroller is the collective name for all microcontrollers compatible with the Intel 8031 instruction system. The ancestor of this series of microcontrollers is Intel's 8004 microcontroll...[Details]
Shanghai - July 6, 2023 - Ascend will bring a broader portfolio of engineering materials and fiber technologies to the 2023 Automotive Engineering Expo in Nagoya, Japan, from July 5-7 . At booth No. ...[Details]
Epic Games CEO Tim Sweeney said Apple's App Store has helped app developers earn more than $260 billion since its launch, but it is "hurting" developers and forcing them to make their apps "subpar." ...[Details]
On October 24, according to the official announcement of "Beijing Yizhuang", the country's first all-solid-state lithium battery mass production line was officially put into production recently.
...[Details]
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
