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K7M163625A-QI85

Description
ZBT SRAM, 512KX36, 8.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
Categorystorage    storage   
File Size618KB,28 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7M163625A-QI85 Overview

ZBT SRAM, 512KX36, 8.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100

K7M163625A-QI85 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codecompli
ECCN code3A991.B.2.A
Maximum access time8.5 ns
Other featuresFLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density18874368 bi
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.06 A
Minimum standby current3.14 V
Maximum slew rate0.23 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
K7M163625A
K7M163225A
K7M161825A
Document Title
512Kx36/32 & 1Mx18 Flow-Through NtRAM
TM
512Kx36/32 & 1Mx18-Bit Flow Through NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
0.3
History
1. Initial document.
1. Add JTAG Scan Order
1. Remove bin -90
2. Updated DC characteristics(ICC,ISB,ISB1,ISB2)
1. Add x32 org and industrial temperature .
2. Add 165FBGA package
1. Final spec release
Draft Date
Feb. 23. 2001
May. 10. 2001
Aug. 03. 2001
Aug. 30. 2001
Remark
Preliminary
Preliminary
Preliminary
Preliminary
1.0
May. 10. 2002
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
May 2002
Rev 1.0

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