K6F8008R2B-EF850 datasheet, PDF

K6F8008R2B-EF850: DescriptionStandard SRAM, 1MX8, 85ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, TBGA-48; Categorystorage storage; File Size151KB，9 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K6F8008R2B-EF850 Overview

Standard SRAM, 1MX8, 85ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, TBGA-48

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	48
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	85 ns
JESD-30 code	R-PBGA-B48
length	7 mm
memory density	8388608 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	2.2 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6 mm

K6F8008R2B Family

Document Title

1M x8 bit Super Low Power and Low Voltage Full CMOS Static RAM

Preliminary

CMOS SRAM

Revision History

Revision No. History

0.0

Initial draft

Draft Date

October 31, 2001

Remark

Preliminary

The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and

products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.

Revision 0.0

October 2001

	K6F8008R2B-EF850	K6F8008R2B-EF700
Description	Standard SRAM, 1MX8, 85ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, TBGA-48	Standard SRAM, 1MX8, 70ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, TBGA-48
Maker	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA
package instruction	VFBGA,	VFBGA,
Contacts	48	48
Reach Compliance Code	unknow	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A
Maximum access time	85 ns	70 ns
JESD-30 code	R-PBGA-B48	R-PBGA-B48
length	7 mm	7 mm
memory density	8388608 bi	8388608 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	8	8
Number of functions	1	1
Number of terminals	48	48
word count	1048576 words	1048576 words
character code	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	1MX8	1MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm
Maximum supply voltage (Vsup)	2.2 V	2.2 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V
Nominal supply voltage (Vsup)	2 V	2 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM
width	6 mm	6 mm

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