EEWORLDEEWORLDEEWORLD

Part Number

Search

XPC855TCZP50D4

Description
IC,COMMUNICATIONS CONTROLLER,CMOS,BGA,357PIN
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,80 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

XPC855TCZP50D4 Overview

IC,COMMUNICATIONS CONTROLLER,CMOS,BGA,357PIN

XPC855TCZP50D4 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
Parts packaging codeBGA
package instructionBGA, BGA357,19X19,50
Contacts357
Reach Compliance Code_compli
ECCN code5A991
Address bus width32
bit size32
boundary scanYES
maximum clock frequency50 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B357
JESD-609 codee0
length25 mm
low power modeYES
Humidity sensitivity level3
Number of terminals357
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA357,19X19,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)220
power supply3.3 V
Certification statusNot Qualified
Maximum seat height2.05 mm
speed50 MHz
Maximum supply voltage3.465 V
Minimum supply voltage3.135 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor, Inc.
Advance Information
MPC860EC
Rev. 6.3 9/2003
MPC860 Family
Hardware Specifications
Freescale Semiconductor, Inc...
This hardware specification contains detailed information on power considerations, DC/AC
electrical characteristics, and AC timing specifications for the MPC860 family.
This hardware specification covers the following topics:
Topic
Section 1, “Overview”
Section 2, “Features”
Section 3, “Maximum Tolerated Ratings”
Section 4, “Thermal Characteristics”
Section 5, “Power Dissipation”
Section 6, “DC Characteristics”
Section 7, “Thermal Calculation and Measurement”
Section 8, “Layout Practices”
Section 9, “Bus Signal Timing”
Section 10, “IEEE 1149.1 Electrical Specifications”
Section 11, “CPM Electrical Characteristics”
Section 12, “UTOPIA AC Electrical Specifications”
Section 13, “FEC Electrical Characteristics”
Section 14, “Mechanical Data and Ordering Information”
Section 15, “Document Revision History”
Page
2
2
6
7
8
8
10
12
12
40
42
65
67
71
76
For More Information On This Product,
Go to: www.freescale.com

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号