MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023
Parameter Name | Attribute value |
Maker | NXP |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 1023 |
Reach Compliance Code | unknow |
Address bus width | 16 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 166.66 MHz |
External data bus width | 64 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-CBGA-B1023 |
length | 33 mm |
low power mode | YES |
Number of terminals | 1023 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.77 mm |
speed | 1500 MHz |
Maximum supply voltage | 1.15 V |
Minimum supply voltage | 1.05 V |
Nominal supply voltage | 1.1 V |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
width | 33 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |