LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Parameter Name | Attribute value |
Maker | NXP |
package instruction | HVQCCN, |
Reach Compliance Code | unknow |
series | LVC/LCX/Z |
JESD-30 code | R-PQCC-N14 |
length | 3 mm |
Logic integrated circuit type | INVERTER |
Number of functions | 6 |
Number of entries | 1 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | HVQCCN |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
propagation delay (tpd) | 14.7 ns |
Filter level | AEC-Q100 |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 1.65 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
width | 2.5 mm |
935299272115 | 74LVC14AD-Q100J | 74LVC14ABQ-Q100X | 935299273118 | 935299274118 | |
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Description | LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | IC schmitt trig hex inv 14soic | IC schmitt trig hex inv 14dhvqfn | LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 | LVC/LCX/Z SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 |
Maker | NXP | NXP | NXP | NXP | NXP |
package instruction | HVQCCN, | 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 | SOP, | TSSOP, |
Reach Compliance Code | unknow | compliant | compliant | unknown | unknow |
series | LVC/LCX/Z | - | - | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 code | R-PQCC-N14 | - | - | R-PDSO-G14 | R-PDSO-G14 |
length | 3 mm | - | - | 8.65 mm | 5 mm |
Logic integrated circuit type | INVERTER | - | - | INVERTER | INVERTER |
Number of functions | 6 | - | - | 6 | 6 |
Number of entries | 1 | - | - | 1 | 1 |
Number of terminals | 14 | - | - | 14 | 14 |
Maximum operating temperature | 125 °C | - | - | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | - | - | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | HVQCCN | - | - | SOP | TSSOP |
Package shape | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
propagation delay (tpd) | 14.7 ns | - | - | 14.7 ns | 14.7 ns |
Filter level | AEC-Q100 | - | - | AEC-Q100 | AEC-Q100 |
Maximum seat height | 1 mm | - | - | 1.75 mm | 1.1 mm |
Maximum supply voltage (Vsup) | 3.6 V | - | - | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 1.65 V | - | - | 1.65 V | 1.65 V |
Nominal supply voltage (Vsup) | 3.3 V | - | - | 3.3 V | 3.3 V |
surface mount | YES | - | - | YES | YES |
technology | CMOS | - | - | CMOS | CMOS |
Temperature level | AUTOMOTIVE | - | - | AUTOMOTIVE | AUTOMOTIVE |
Terminal form | NO LEAD | - | - | GULL WING | GULL WING |
Terminal pitch | 0.5 mm | - | - | 1.27 mm | 0.65 mm |
Terminal location | QUAD | - | - | DUAL | DUAL |
width | 2.5 mm | - | - | 3.9 mm | 4.4 mm |