IC DUAL OP-AMP, 900 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | National Semiconductor(TI ) |
Parts packaging code | SOIC |
package instruction | SOP, SOP8,.25 |
Contacts | 8 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Amplifier type | OPERATIONAL AMPLIFIER |
Architecture | VOLTAGE-FEEDBACK |
Maximum average bias current (IIB) | 0.000004 µA |
Minimum Common Mode Rejection Ratio | 72 dB |
Nominal Common Mode Rejection Ratio | 85 dB |
frequency compensation | YES |
Maximum input offset voltage | 900 µV |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
length | 4.9 mm |
low-bias | YES |
low-dissonance | YES |
micropower | YES |
Humidity sensitivity level | 1 |
Negative supply voltage upper limit | |
Nominal Negative Supply Voltage (Vsup) | |
Number of functions | 2 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
method of packing | RAIL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5/15 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
minimum slew rate | 0.01 V/us |
Nominal slew rate | 35000 V/us |
Maximum slew rate | 0.055 mA |
Supply voltage upper limit | 16 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
Nominal Uniform Gain Bandwidth | 100 kHz |
Minimum voltage gain | 50000 |
width | 3.9 mm |
LMC6062AIM/NOPB | |
---|---|
Description | IC DUAL OP-AMP, 900 uV OFFSET-MAX, 0.1 MHz BAND WIDTH, PDSO8, ROHS COMPLIANT, SOIC-8, Operational Amplifier |
Is it Rohs certified? | conform to |
Maker | National Semiconductor(TI ) |
Parts packaging code | SOIC |
package instruction | SOP, SOP8,.25 |
Contacts | 8 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Amplifier type | OPERATIONAL AMPLIFIER |
Architecture | VOLTAGE-FEEDBACK |
Maximum average bias current (IIB) | 0.000004 µA |
Minimum Common Mode Rejection Ratio | 72 dB |
Nominal Common Mode Rejection Ratio | 85 dB |
frequency compensation | YES |
Maximum input offset voltage | 900 µV |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
length | 4.9 mm |
low-bias | YES |
low-dissonance | YES |
micropower | YES |
Humidity sensitivity level | 1 |
Number of functions | 2 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
method of packing | RAIL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5/15 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
minimum slew rate | 0.01 V/us |
Nominal slew rate | 35000 V/us |
Maximum slew rate | 0.055 mA |
Supply voltage upper limit | 16 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
Nominal Uniform Gain Bandwidth | 100 kHz |
Minimum voltage gain | 50000 |
width | 3.9 mm |