HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20, CERAMIC, DIP-20
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Motorola ( NXP ) |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 20 |
Reach Compliance Code | unknow |
Other features | WITH DUAL OUTPUT ENABLE |
series | HC/UH |
JESD-30 code | R-CDIP-T20 |
JESD-609 code | e0 |
length | 24.515 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUS DRIVER |
Number of digits | 8 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 20 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Output polarity | INVERTED |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
propagation delay (tpd) | 38 ns |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
MC54HC540J | MC74HC540DWR2 | MC74HC540N | MC74HC540DW | |
---|---|---|---|---|
Description | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20, CERAMIC, DIP-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, SOIC-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20, PLASTIC, DIP-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, SOIC-20 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
Parts packaging code | DIP | SOIC | DIP | SOIC |
package instruction | DIP, | SOP, | DIP, | SOP, |
Contacts | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknow | unknown | unknown | unknow |
Other features | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
series | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 code | R-CDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 24.515 mm | 12.8 mm | 26.415 mm | 12.8 mm |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
Number of digits | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of ports | 2 | 2 | 2 | 2 |
Number of terminals | 20 | 20 | 20 | 20 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Output polarity | INVERTED | INVERTED | INVERTED | INVERTED |
Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | DIP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
propagation delay (tpd) | 38 ns | 38 ns | 38 ns | 38 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 2.65 mm | 4.57 mm | 2.65 mm |
Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V |
Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm |