DRAM, 16MX72, 0.75ns, CMOS, PDMA184
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Micron Technology |
| Reach Compliance Code | unknow |
| Maximum access time | 0.75 ns |
| Maximum clock frequency (fCLK) | 133 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PDMA-N184 |
| memory density | 1207959552 bi |
| memory width | 72 |
| Humidity sensitivity level | 1 |
| Number of terminals | 184 |
| word count | 16777216 words |
| character code | 16000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16MX72 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIMM |
| Encapsulate equivalent code | DIMM184 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | 235 |
| power supply | 2.5 V |
| Certification status | Not Qualified |
| refresh cycle | 4096 |
| Maximum standby current | 0.027 A |
| Maximum slew rate | 2.925 mA |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
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