Flash, 512KX8, 80ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP1-56
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Micron Technology |
Parts packaging code | TSOP1 |
package instruction | 14 X 20 MM, PLASTIC, TSOP1-56 |
Contacts | 56 |
Reach Compliance Code | _compli |
ECCN code | EAR99 |
Maximum access time | 80 ns |
Other features | AUTOMATIC WRITE; DEEP POWER-DOWN |
Spare memory width | 16 |
startup block | TOP |
command user interface | YES |
Data polling | NO |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G56 |
JESD-609 code | e0 |
length | 18.4 mm |
memory density | 4194304 bi |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of departments/size | 1,2,1,3 |
Number of terminals | 56 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP1 |
Encapsulate equivalent code | TSSOP56,.8,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3/5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Department size | 16K,8K,96K,128K |
Maximum standby current | 0.000002 A |
Maximum slew rate | 0.06 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
type | NOR TYPE |
width | 14 mm |