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25LC040T/ST

Description
512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8
Categorystorage    storage   
File Size372KB,12 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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25LC040T/ST Overview

512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8

25LC040T/ST Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instructionTSSOP,
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresDATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES
Maximum clock frequency (fCLK)2 MHz
Data retention time - minimum200
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.4 mm
memory density4096 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512X8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Serial bus typeSPI
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Maximum write cycle time (tWC)5 ms
Base Number Matches1

25LC040T/ST Related Products

25LC040T/ST 25LC040/ST 25AA040/STG 25AA040T/STG 25AA040T/ST 25AA040/ST
Description 512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Parts packaging code SOIC SOIC SOIC SOIC SOIC SOIC
package instruction TSSOP, TSSOP-8 TSSOP-8 TSSOP, TSSOP, TSSOP-8
Contacts 8 8 8 8 8 8
Reach Compliance Code compli compli compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES
Maximum clock frequency (fCLK) 2 MHz 2 MHz 1 MHz 1 MHz 1 MHz 1 MHz
Data retention time - minimum 200 200 200 200 200 200
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 e3 e3 e3 e3 e3
length 4.4 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm
memory density 4096 bi 4096 bi 4096 bi 4096 bi 4096 bi 4096 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Humidity sensitivity level 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 512 words 512 words 512 words 512 words 512 words 512 words
character code 512 512 512 512 512 512
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512X8 512X8 512X8 512X8 512X8 512X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Serial bus type SPI SPI SPI SPI SPI SPI
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.5 V 2.5 V 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40 40 40
width 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Base Number Matches 1 1 1 1 1 1
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