|
25LC040T/ST |
25LC040/ST |
25AA040/STG |
25AA040T/STG |
25AA040T/ST |
25AA040/ST |
Description |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 |
512 X 8 SPI BUS SERIAL EEPROM, PDSO8, TSSOP-8 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
package instruction |
TSSOP, |
TSSOP-8 |
TSSOP-8 |
TSSOP, |
TSSOP, |
TSSOP-8 |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Other features |
DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES |
DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES |
DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES |
DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES |
DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES |
DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES |
Maximum clock frequency (fCLK) |
2 MHz |
2 MHz |
1 MHz |
1 MHz |
1 MHz |
1 MHz |
Data retention time - minimum |
200 |
200 |
200 |
200 |
200 |
200 |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
length |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
memory density |
4096 bi |
4096 bi |
4096 bi |
4096 bi |
4096 bi |
4096 bi |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
word count |
512 words |
512 words |
512 words |
512 words |
512 words |
512 words |
character code |
512 |
512 |
512 |
512 |
512 |
512 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
organize |
512X8 |
512X8 |
512X8 |
512X8 |
512X8 |
512X8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
Serial bus type |
SPI |
SPI |
SPI |
SPI |
SPI |
SPI |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
40 |
40 |
width |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
Maximum write cycle time (tWC) |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |