Flash PLD, 6ns, 384-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FTBGA-256
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | XILINX |
Parts packaging code | BGA |
package instruction | LBGA, BGA256,16X16,40 |
Contacts | 256 |
Reach Compliance Code | compli |
Other features | YES |
In-system programmable | YES |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e1 |
JTAG BST | YES |
length | 17 mm |
Humidity sensitivity level | 3 |
Dedicated input times | |
Number of I/O lines | 212 |
Number of macro cells | 384 |
Number of terminals | 256 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 0 DEDICATED INPUTS, 212 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.5/3.3,1.8 V |
Programmable logic type | FLASH PLD |
propagation delay | 6 ns |
Certification status | Not Qualified |
Maximum seat height | 1.55 mm |
Maximum supply voltage | 1.9 V |
Minimum supply voltage | 1.7 V |
Nominal supply voltage | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 17 mm |
XC2C384-6FTG256C | XC2C384-6FGG324C | XC2C384-6TQG144C | XC2C384-6TQ144C | XC2C384-6FG324C | XC2C384-6FT256C | XC2C384-6PQ208C | XC2C384-6PQG208C | |
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Description | Flash PLD, 6ns, 384-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FTBGA-256 | Flash PLD, 6ns, 384-Cell, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-324 | Flash PLD, 6ns, 384-Cell, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144 | Flash PLD, 6ns, 384-Cell, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | Flash PLD, 6ns, 384-Cell, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, FBGA-324 | Flash PLD, 6ns, 384-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FTBGA-256 | Flash PLD, 6ns, 384-Cell, CMOS, PQFP208, 28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208 | Flash PLD, 6ns, 384-Cell, CMOS, PQFP208, 28 X 28 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFP-208 |
Is it Rohs certified? | conform to | conform to | conform to | incompatible | incompatible | incompatible | incompatible | conform to |
Maker | XILINX | XILINX | XILINX | XILINX | XILINX | XILINX | XILINX | XILINX |
Parts packaging code | BGA | BGA | QFP | QFP | BGA | BGA | QFP | QFP |
package instruction | LBGA, BGA256,16X16,40 | BGA, BGA324,22X22,40 | LFQFP, QFP144,.87SQ,20 | 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | 23 X 23 MM, 1 MM PITCH, FBGA-324 | 17 X 17 MM, 1 MM PITCH, FTBGA-256 | 28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208 | FQFP, QFP208,1.2SQ,20 |
Contacts | 256 | 324 | 144 | 144 | 324 | 256 | 208 | 208 |
Reach Compliance Code | compli | compliant | compliant | not_compliant | not_compliant | not_compliant | compli | compli |
Other features | YES | YES | YES | YES | YES | YES | YES | YES |
In-system programmable | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 code | S-PBGA-B256 | S-PBGA-B324 | S-PQFP-G144 | S-PQFP-G144 | S-PBGA-B324 | S-PBGA-B256 | S-PQFP-G208 | S-PQFP-G208 |
JESD-609 code | e1 | e1 | e3 | e0 | e0 | e0 | e0 | e3 |
JTAG BST | YES | YES | YES | YES | YES | YES | YES | YES |
length | 17 mm | 23 mm | 20 mm | 20 mm | 23 mm | 17 mm | 28 mm | 28 mm |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Number of I/O lines | 212 | 240 | 118 | 118 | 240 | 212 | 173 | 173 |
Number of macro cells | 384 | 384 | 384 | 384 | 384 | 384 | 384 | 384 |
Number of terminals | 256 | 324 | 144 | 144 | 324 | 256 | 208 | 208 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 0 DEDICATED INPUTS, 212 I/O | 0 DEDICATED INPUTS, 240 I/O | 0 DEDICATED INPUTS, 118 I/O | 0 DEDICATED INPUTS, 118 I/O | 0 DEDICATED INPUTS, 240 I/O | 0 DEDICATED INPUTS, 212 I/O | 0 DEDICATED INPUTS, 173 I/O | 0 DEDICATED INPUTS, 173 I/O |
Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LBGA | BGA | LFQFP | LFQFP | BGA | LBGA | FQFP | FQFP |
Encapsulate equivalent code | BGA256,16X16,40 | BGA324,22X22,40 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | BGA324,22X22,40 | BGA256,16X16,40 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY | GRID ARRAY, LOW PROFILE | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 | 250 | 260 | 225 | 225 | 240 | 225 | 245 |
power supply | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V |
Programmable logic type | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
propagation delay | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.55 mm | 2.5 mm | 1.6 mm | 1.6 mm | 2.5 mm | 1.55 mm | 4.1 mm | 4.1 mm |
Maximum supply voltage | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
Minimum supply voltage | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
Nominal supply voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) |
Terminal form | BALL | BALL | GULL WING | GULL WING | BALL | BALL | GULL WING | GULL WING |
Terminal pitch | 1 mm | 1 mm | 0.5 mm | 0.5 mm | 1 mm | 1 mm | 0.5 mm | 0.5 mm |
Terminal location | BOTTOM | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM | QUAD | QUAD |
Maximum time at peak reflow temperature | 40 | 40 | 40 | 30 | 30 | 30 | 30 | 40 |
width | 17 mm | 23 mm | 20 mm | 20 mm | 23 mm | 17 mm | 28 mm | 28 mm |