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XC2C384-6FTG256C

Description
Flash PLD, 6ns, 384-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FTBGA-256
CategoryProgrammable logic devices    Programmable logic   
File Size417KB,24 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
Environmental Compliance
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XC2C384-6FTG256C Overview

Flash PLD, 6ns, 384-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FTBGA-256

XC2C384-6FTG256C Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerXILINX
Parts packaging codeBGA
package instructionLBGA, BGA256,16X16,40
Contacts256
Reach Compliance Codecompli
Other featuresYES
In-system programmableYES
JESD-30 codeS-PBGA-B256
JESD-609 codee1
JTAG BSTYES
length17 mm
Humidity sensitivity level3
Dedicated input times
Number of I/O lines212
Number of macro cells384
Number of terminals256
Maximum operating temperature70 °C
Minimum operating temperature
organize0 DEDICATED INPUTS, 212 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA256,16X16,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1.5/3.3,1.8 V
Programmable logic typeFLASH PLD
propagation delay6 ns
Certification statusNot Qualified
Maximum seat height1.55 mm
Maximum supply voltage1.9 V
Minimum supply voltage1.7 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width17 mm

XC2C384-6FTG256C Related Products

XC2C384-6FTG256C XC2C384-6FGG324C XC2C384-6TQG144C XC2C384-6TQ144C XC2C384-6FG324C XC2C384-6FT256C XC2C384-6PQ208C XC2C384-6PQG208C
Description Flash PLD, 6ns, 384-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FTBGA-256 Flash PLD, 6ns, 384-Cell, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-324 Flash PLD, 6ns, 384-Cell, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144 Flash PLD, 6ns, 384-Cell, CMOS, PQFP144, 20 X 20 MM, 0.50 MM PITCH, TQFP-144 Flash PLD, 6ns, 384-Cell, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, FBGA-324 Flash PLD, 6ns, 384-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FTBGA-256 Flash PLD, 6ns, 384-Cell, CMOS, PQFP208, 28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208 Flash PLD, 6ns, 384-Cell, CMOS, PQFP208, 28 X 28 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFP-208
Is it Rohs certified? conform to conform to conform to incompatible incompatible incompatible incompatible conform to
Maker XILINX XILINX XILINX XILINX XILINX XILINX XILINX XILINX
Parts packaging code BGA BGA QFP QFP BGA BGA QFP QFP
package instruction LBGA, BGA256,16X16,40 BGA, BGA324,22X22,40 LFQFP, QFP144,.87SQ,20 20 X 20 MM, 0.50 MM PITCH, TQFP-144 23 X 23 MM, 1 MM PITCH, FBGA-324 17 X 17 MM, 1 MM PITCH, FTBGA-256 28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208 FQFP, QFP208,1.2SQ,20
Contacts 256 324 144 144 324 256 208 208
Reach Compliance Code compli compliant compliant not_compliant not_compliant not_compliant compli compli
Other features YES YES YES YES YES YES YES YES
In-system programmable YES YES YES YES YES YES YES YES
JESD-30 code S-PBGA-B256 S-PBGA-B324 S-PQFP-G144 S-PQFP-G144 S-PBGA-B324 S-PBGA-B256 S-PQFP-G208 S-PQFP-G208
JESD-609 code e1 e1 e3 e0 e0 e0 e0 e3
JTAG BST YES YES YES YES YES YES YES YES
length 17 mm 23 mm 20 mm 20 mm 23 mm 17 mm 28 mm 28 mm
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of I/O lines 212 240 118 118 240 212 173 173
Number of macro cells 384 384 384 384 384 384 384 384
Number of terminals 256 324 144 144 324 256 208 208
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 0 DEDICATED INPUTS, 212 I/O 0 DEDICATED INPUTS, 240 I/O 0 DEDICATED INPUTS, 118 I/O 0 DEDICATED INPUTS, 118 I/O 0 DEDICATED INPUTS, 240 I/O 0 DEDICATED INPUTS, 212 I/O 0 DEDICATED INPUTS, 173 I/O 0 DEDICATED INPUTS, 173 I/O
Output function MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA BGA LFQFP LFQFP BGA LBGA FQFP FQFP
Encapsulate equivalent code BGA256,16X16,40 BGA324,22X22,40 QFP144,.87SQ,20 QFP144,.87SQ,20 BGA324,22X22,40 BGA256,16X16,40 QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY, LOW PROFILE FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius) 260 250 260 225 225 240 225 245
power supply 1.5/3.3,1.8 V 1.5/3.3,1.8 V 1.5/3.3,1.8 V 1.5/3.3,1.8 V 1.5/3.3,1.8 V 1.5/3.3,1.8 V 1.5/3.3,1.8 V 1.5/3.3,1.8 V
Programmable logic type FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD
propagation delay 6 ns 6 ns 6 ns 6 ns 6 ns 6 ns 6 ns 6 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.55 mm 2.5 mm 1.6 mm 1.6 mm 2.5 mm 1.55 mm 4.1 mm 4.1 mm
Maximum supply voltage 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Matte Tin (Sn) Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15) Matte Tin (Sn)
Terminal form BALL BALL GULL WING GULL WING BALL BALL GULL WING GULL WING
Terminal pitch 1 mm 1 mm 0.5 mm 0.5 mm 1 mm 1 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM QUAD QUAD BOTTOM BOTTOM QUAD QUAD
Maximum time at peak reflow temperature 40 40 40 30 30 30 30 40
width 17 mm 23 mm 20 mm 20 mm 23 mm 17 mm 28 mm 28 mm
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